MCP23008-E/SO Microchip Technology, MCP23008-E/SO Datasheet - Page 41
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MCP23008-E/SO
Manufacturer Part Number
MCP23008-E/SO
Description
IC I/O EXPANDER I2C 8B 18SOIC
Manufacturer
Microchip Technology
Specifications of MCP23008-E/SO
Package / Case
18-SOIC (7.5mm Width)
Interface
I²C
Number Of I /o
8
Interrupt Output
Yes
Frequency - Clock
1.7MHz
Voltage - Supply
1.8 V ~ 5.5 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Includes
POR
Logic Family
MCP23008
Propagation Delay Time
50 ns
Operating Supply Voltage
1.8 V to 5.5 V
Power Dissipation
700 mW
Operating Temperature Range
- 40 C to + 125 C
Input Voltage
1.8 V to 5.5 V
Logic Type
I/O Expander
Maximum Clock Frequency
10 MHz
Maximum Operating Frequency
1.7 MHz
Mounting Style
SMD/SMT
Output Current
25 mA
Output Voltage
1.8 V to 4.5 V
Chip Configuration
8 Bit
Bus Frequency
1.7MHz
Ic Interface Type
I2C, Serial
No. Of I/o's
8
Supply Voltage Range
1.8V To 5.5V
Digital Ic Case Style
SOIC
No. Of Pins
18
Delay Time
50ns
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
GPIODM-KPLCD - BOARD DEMO LCD GPIO EXP KEYPAD
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCP23008-E/SO
Manufacturer:
MICROCHIP
Quantity:
8 700
Part Number:
MCP23008-E/SO
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office
© 2007 Microchip Technology Inc.
PART NO.
Device
Temperature
Range
Package
Device
Temperature
–
Range
MCP23008T:
MCP23S08:
MCP23S08T:
E
* While these devices are only offered in the “E”
temperature range, the device will operate at different
voltages and temperatures as identified in the
Section 2.0 “Electrical Characteristics”.
ML
P
SO
SS
MCP23008:
X
=
=
=
=
=
Plastic Quad Flat, No Lead Package
Plastic DIP (300 mil Body), 18-Lead
Plastic SOIC (300 mil Body), 18-Lead
SSOP, (209 mil Body, 5.30 mm), 20-Lead
Package
-40°C to +125°C (Extended) *
4x4x0.9 mm Body (QFN), 20-Lead
/XX
8-Bit I/O Expander w/ I
8-Bit I/O Expander w/ I
(Tape and Reel)
8-Bit I/O Expander w/ SPI Interface
8-Bit I/O Expander w/ SPI Interface
(Tape and Reel)
2
2
C™ Interface
C Interface
MCP23008/MCP23S08
Examples:
a)
b)
c)
d)
e)
f)
a)
b)
c)
d)
e)
f)
MCP23008-E/P:
MCP23008-E/SO: Extended Temp.,
MCP23008T-E/SO: Tape and Reel,
MCP23008-E/SS:
MCP23008T-E/SS: Tape and Reel,
MCP23008-E/ML:
MCP23S08-E/P:
MCP23S08-E/SO: Extended Temp.,
MCP23S08T-E/SO: Tape and Reel,
MCP23S08-E/SS: Extended Temp.,
MCP23S08T-E/SS: Tape and Reel,
MCP23S08T-E/MF: Tape and Reel,
.
Extended Temp.,
18LD PDIP package.
18LD SOIC package.
Extended Temp.,
18LD SOIC package.
Extended Temp.,
20LD SSOP package.
Extended Temp.,
20LD SSOP package.
Extended Temp.,
20LD QFN package.
Extended Temp.,
18LD PDIP package.
18LD SOIC package.
Extended Temp.,
18LD SOIC package.
20LD SSOP package.
Extended Temp.,
20LD SSOP package.
Extended Temp.,
20LD QFN package.
DS21919E-page 41