MCP23S17-E/SP Microchip Technology, MCP23S17-E/SP Datasheet - Page 38

• Manufacturer Part Number: MCP23S17-E/SP
• Description: IC I/O EXPANDER SPI 16B 28SDIP
• Manufacturer: Microchip Technology
• Type: I/O Expanderr

Specifications of MCP23S17-E/SP

• Package / Case: 28-DIP (0.300", 7.62mm)
• Interface: SPI
• Number Of I /o: 16
• Interrupt Output: Yes
• Frequency - Clock: 10MHz
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: Through Hole
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: MCP23X17EV - BOARD EVAL FOR MCP23X17GPIODM-KPLCD - BOARD DEMO LCD GPIO EXP KEYPAD
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

MCP23017/MCP23S17
28-Lead Skinny Plastic Dual In-Line (SP) – 300 mil Body [SPDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
DS21952B-page 38
NOTE 1
A1
Note:
A
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
N
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1
2
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
3
b
b1
D
Dimension Limits
Units
A2
A1
E1
eB
b1
N
A
E
D
e
L
c
b
e
1.345
.120
.015
.290
.240
.110
.008
.040
.014
A2
MIN
E1
–
–
L
.100 BSC
INCHES
1.365
NOM
.310
.285
.130
.010
.050
.018
.135
28
–
–
–
Microchip Technology Drawing C04-070B
© 2007 Microchip Technology Inc.
eB
E
1.400
MAX
.200
.150
.335
.295
.150
.015
.070
.022
.430
–
c