C2012C0G2A332JT TDK Corporation, C2012C0G2A332JT Datasheet - Page 28

• Manufacturer Part Number: C2012C0G2A332JT
• Description: Multilayer Ceramic Capacitors (MLCC) - SMD/SMT 0805 3300pF 100volts C0G 5%
• Manufacturer: TDK Corporation
• Series: C2012r

Specifications of C2012C0G2A332JT

• Capacitance: 3300 pF
• Tolerance: 5 %
• Voltage Rating: 100 Volts
• Operating Temperature Range: - 55 C to + 125 C
• Temperature Coefficient / Code: C0G (NP0)
• Package / Case: 0805 (2012 metric)
• Product: General Type MLCCs
• Dimensions: 1.250 mm W x 2.000 mm L x 0.850 mm H
• Termination Style: SMD/SMT
• Lead Free Status / Rohs Status: Details
• Other names: C2012C0G2A332J

TDK MLCC US Catalog
Wave Soldering
Symbol
Reflow Soldering
Symbol
Reflow Soldering
Symbol
Excessive
solder
Adequate
solder
Insufficient
solder
• Recommended Soldering Land Pattern
• Recommended Solder Amount
A
B
C
A
B
C
A
B
C
Type
Type
Type
Soldering
Information
C
B
0.35 - 0.45
[CC0603]
[CC0402]
[CC1206]
0.7 - 1.0
0.8 - 1.0
0.6 - 0.8
0.3 - 0.5
0.4 - 0.6
2.0 - 2.4
1.0 - 1.2
1.1 - 1.6
C1608
C1005
C3216
Chip capacitor
A
[CC0805]
[CC0603]
[CC1210]
1.0 - 1.3
1.0 - 1.2
0.8 - 1.1
0.6 - 0.8
0.6 - 0.8
0.6 - 0.8
2.0 - 2.4
1.0 - 1.2
1.9 - 2.5
C2012
C1608
C3225
Solder land
[CC1206]
[CC0805]
[CC1812]
2.1 - 2.5
1.1 - 1.3
1.0 - 1.3
0.9 - 1.2
0.7 - 0.9
0.9 - 1.2
3.1 - 3.7
1.2 - 1.4
2.4 - 3.2
Unit: mm
C3216
Unit: mm
C2012
C4532
Solder resist
Maximum amount
Minimum amount
Higher tensile
force on the chip
capacitor may
cause cracking.
Small solder fillet
may cause
contact failure or
failure to hold the
chip capacitor to
the P.C. board.
[CC2220]
4.1 - 4.8
1.2 - 1.4
4.0 - 5.0
Unit: mm
C5750
C Series – Mid Voltage Application
Page 102
Peak
Temp
• Recommended Soldering Profile
0
Solder
Over 60 sec.
Recommended soldering duration
Recommended solder compositions
Preheating
Lead-Free
Preheating Condition
Soldering
soldering
soldering
soldering
Sn-37Pb (Sn-Pb solder)
Sn-3.0Ag-0.5Cu (Lead Free Solder)
Solder
Solder
Manual
Sn-Pb
Reflow
Wave
△T
Wave Soldering
Temp./
Peak Temp time
Dura.
Soldering
300
0
C1608(CC0603), C2012(CC0805),
C3216(CC1206)
C1005(CC0402), C1608(CC0603),
C2012(CC0805), C3216(CC1206)
C3225(CC1210), C4532(CC1812),
C5750(CC2220)
C1005(CC0402), C1608(CC0603),
C2012(CC0805), C3216(CC1206)
C3225(CC1210), C4532(CC1812),
C5750(CC2220)
Peak temp
250 max.
260 max.
Over 60 sec.
(°C)
Wave Soldering
Natural
cooling
Case Size - JIS (EIA)
∆T
Manual soldering
Preheating
(Solder iron)
Duration
Peak
Temp
3sec. (As short as possible)
3 max.
5 max.
(sec.)
0
∆T
Over 60 sec.
Preheating
Peak temp
Reflow Soldering
230 max.
260 max.
(°C)
Reflow Soldering
Peak Temp time
Soldering Natural
Version B11
Temp. (ºC)
∆T ≤ 150
∆T ≤ 150
∆T ≤ 130
∆T ≤ 150
∆T ≤ 130
Duration
20 max.
10 max.
(sec.)
cooling