MCP2122-E/SN Microchip Technology, MCP2122-E/SN Datasheet - Page 31

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MCP2122-E/SN

Manufacturer Part Number
MCP2122-E/SN
Description
IC ENCODER/DECODER IRDA 8SOIC
Manufacturer
Microchip Technology
Type
Infrared Encoder/Decoderr
Datasheets

Specifications of MCP2122-E/SN

Package / Case
8-SOIC (3.9mm Width)
Applications
Data-Logging, Data Exchange
Voltage - Supply, Analog
1.8 V ~ 5.5 V
Voltage - Supply, Digital
1.8 V ~ 5.5 V
Mounting Type
Surface Mount
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1.8 V
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Ic Function
Encoder / Decoder IC
Supply Voltage Range
1.8V To 5.5V
Operating Temperature Range
-40°C To +125°C
Digital Ic Case Style
SOIC
No. Of Pins
8
Leaded Process Compatible
Yes
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
MCP212XDM - BOARD DEVELOPMENT IRDA
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
MCP2122-E/SNG
MCP2122-E/SNG

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCP2122-E/SN
Manufacturer:
Vicor
Quantity:
20
Part Number:
MCP2122-E/SN
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Part Number:
MCP2122-E/SNG
Manufacturer:
PIXIM
Quantity:
7
© 2007 Microchip Technology Inc.
8-Lead Plastic Small Outline (SN or OA) – Narrow, 3.90 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
NOTE 1
A
A1
§
N
1
2
D
b
3
e
Dimension Limits
Preliminary
A2
E1
E
Units
φ
A2
A1
E1
L1
N
D
A
E
α
e
h
L
φ
c
b
β
0.10
0.25
0.40
0.31
MIN
1.25
0.17
L1
h
L
MILLIMETERS
h
6.00 BSC
4.90 BSC
1.27 BSC
3.90 BSC
1.04 REF
NOM
8
Microchip Technology Drawing C04-057B
α
β
MAX
1.75
0.25
0.50
1.27
0.25
0.51
15°
15°
MCP2122
c
DS21894C-page 31

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