NLSF3T125MNR2 ON Semiconductor, NLSF3T125MNR2 Datasheet - Page 7

• Manufacturer Part Number: NLSF3T125MNR2
• Description: Buffers & Line Drivers 2-5.5V Quad Bus
• Manufacturer: ON Semiconductor

Specifications of NLSF3T125MNR2

• Logic Family: NLSF
• Logic Type: CMOS
• Number Of Channels Per Chip: 4
• Polarity: Non-Inverting
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: QFN-16
• High Level Output Current: - 8 mA
• Low Level Output Current: 8 mA
• Maximum Power Dissipation: 500 mW
• Minimum Operating Temperature: - 40 C
• Number Of Lines (input / Output): 4 / 3
• Output Type: 3-State
• Propagation Delay Time: 11.5 ns at 3.3 V
• Lead Free Status / Rohs Status: No RoHS Version Available

16 X
0.10 C
0.05 C
NOTE 5
16X
16X
LOCATION
0.10 C
0.08 C
0.15 C
K
PIN 1
L
0.15 C
NOTE 3
A B
16X
Ç Ç Ç
Ç Ç Ç
b
4
1
16
BOTTOM VIEW
SIDE VIEW
TOP VIEW
5
D2
D
e
13
8
(A3)
12
9
EXPOSED PAD
A1
e
A
B
E
E2
PACKAGE DIMENSIONS
A
C
http://onsemi.com
CASE 485G−01
SEATING
PLANE
NLSF3T125
16 PIN QFN
ISSUE B
7
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.575
0.022
0.128
3.25
SOLDERING FOOTPRINT*
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
4. COPLANARITY APPLIES TO THE EXPOSED
5. L
ASME Y14.5M, 1994.
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
PAD AS WELL AS THE TERMINALS.
MINIMUM SPACING BETWEEN LEAD TIP
AND FLAG
DIM
A1
A3
D2
E2
max
A
b
D
E
K
L
e
0.012
0.30
CONDITION CAN NOT VIOLATE 0.2 MM
MILLIMETERS
0.80
0.00
0.18
1.65
1.65
0.20
0.30
MIN
0.128
3.25
0.20 REF
3.00 BSC
3.00 BSC
0.50 BSC
MAX
1.00
0.05
0.30
1.85
1.85
0.50
−−−
0.50
0.02
SCALE 10:1
EXPOSED PAD
0.059
1.50
0.012
0.30
inches
mm