DS9637ACN National Semiconductor, DS9637ACN Datasheet - Page 2

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DS9637ACN

Manufacturer Part Number
DS9637ACN
Description
IC RCVR DUAL EIA-422/423 8-DIP
Manufacturer
National Semiconductor
Type
Receiverr
Datasheet

Specifications of DS9637ACN

Number Of Drivers/receivers
0/2
Protocol
RS232, RS423
Voltage - Supply
4.5 V ~ 5.5 V
Mounting Type
Through Hole
Package / Case
8-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
*DS9637ACN
DS9637

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Manufacturer
Quantity
Price
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Quantity:
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V
V
I
V
V
I
I
V
t
t
I
OS
CC
PLH
PHL
TH
TH(R)
OL
OH
HYST
Symbol
Absolute Maximum Ratings
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Electrical Characteristics
Over recommended operating temperature and supply voltage ranges, unless otherwise specified
Note 2: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the devices
should be operated at these limits. The tables of “Electrical Characteristics” provide conditions for actual device operation.
Note 3: Unless otherwise specified Min/Max limits apply across the −55°C to +125°C temperature range for DS9637AM and across the 0°C to +70°C range for
the DS9637ASC. All typicals are given for V
Note 4: All currents into the device pins are positive; all currents out of the device pins are negative. All voltages are referenced to ground unless otherwise
specified.
Note 5: Only one output at a time should be shorted.
Note 6: V
Note 7: 500Ω ±1% in series with inputs.
Note 8: The input not under test is tied to ground.
Switching Characteristics
V
Storage Temperature Range
Lead Temperature
Maximum Power Dissipation (Note 1) at 25°C
V
Input Potential to Ground
Symbol
CC
CC
Ceramic DIP
Molded DIP
Ceramic DIP
(Soldering, 30 seconds)
Molded DIP and SO Package
(Soldering, 10 seconds)
Cavity Package
Molded Package
SO Package
= 5.0V, T
Lead Potential to Ground
DIFF
Differential Input
Threshold Voltage (Note 6)
Differential Input
Threshold Voltage (Note 7)
Input Current
(Note 8)
Output Voltage LOW
Output Voltage HIGH
Output Short Circuit
Current (Note 5)
Supply Current
Input Hysteresis
(Differential Input Voltage) = (V
A
Propagation Delay Time
Low to High
Propagation Delay Time
High to Low
= 25°C
Parameter
Parameter
CC
I
+) − (V
= 5V and T
−65°C to + 175°C
−65°C to + 150°C
I
−). V
(Notes 3, 4)
−0.5V to 7.0V
CM
A
(Note 2)
−7.0V
−7.0V
V
V
I
I
V
V
V
V
= 25°C.
OL
OH
See AC Test Circuit
See AC Test Circuit
(Common Mode Input Voltage) = V
I
I
O
CC
I
CM
1300 mW
− = GND
= 10V, 0V
= −10V, 0V
930 mW
810 mW
= 20 mA, V
= 0V, V
= −1.0 mA, V
= Max, V
= ±7.0V (See Curves)
300°C
265°C
±15V
V
V
Conditions
CM
CM
CC
Conditions
I
= Max
+ = 0.5V,
CC
2
V
+7.0V
+7.0V
V
CC
CC
= Min
CC
Recommended Operating
Conditions
Note 1: Derate cavity package 8.7 mW/°C above 25°C; derate molded DIP
package 7.5 mW/°C above 25°C; derate SO package 6.5 mW/°C above 25°
C.
= Min
Differential Input Voltage
Output Potential to Ground
Output Sink Current
ESD Susceptibility, HBM
+5.5V
Supply Voltage (V
Operating Temperature (T
Supply Voltage (V
Operating Temperature (T
+5.5V
I
+ or V
DS9637AM
DS9637AC
I
−.
Min
CC
CC
−0.2
−0.4
Min
−40
2.5
)
)
Typ
15
13
A
A
)
)
−1.6
0.35
Typ
−75
1.1
3.5
35
70
4.75
Min
−55
4.5
0
Max
25
25
−3.25
−100
Max
+0.2
+0.4
3.25
0.5
+125
50
Max
5.25
−0.5V to +5.5V
+70
5.5
Units
Units
50 mA
°C
°C
±15V
Units
ns
ns
V
V
2 kV
mA
mA
mA
mV
V
V
V
V

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