MAX3131EAI+ Maxim Integrated Products, MAX3131EAI+ Datasheet - Page 2

IC TXRX W/RS232 28-SSOP

MAX3131EAI+

Manufacturer Part Number
MAX3131EAI+
Description
IC TXRX W/RS232 28-SSOP
Manufacturer
Maxim Integrated Products
Type
Transceiverr
Datasheet

Specifications of MAX3131EAI+

Number Of Drivers/receivers
2/2
Protocol
RS232
Voltage - Supply
3 V ~ 5 V
Mounting Type
Surface Mount
Package / Case
28-SSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
ABSOLUTE MAXIMUM RATINGS
V
AV
V
AGND, PGND to GND ........................................................±0.1V
V+ to GND ................................................................-0.3V to +7V
V- to GND .................................................................+0.3V to -7V
V+ to V- ................................................................................+13V
Inputs (referenced to GND)
Outputs (referenced to GND)
ELECTRICAL CHARACTERISTICS
(V
values are at T
3V to 5.5V, IrDA Infrared Transceiver with
Integrated RS-232 Interface
2
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Power-Supply Current
Analog Power-Supply Current
CC
CC
DC CHARACTERISTICS
LOGIC INPUTS (T1IN, T2IN, TXD, IRMODE, BAUD16, IRSD, RSSD)
LOGIC OUTPUTS (R1OUT, R2OUT, RXD, EDGEDET)
IR RECEIVER
Shutdown Supply Current
Shutdown Analog Supply Current
Input Logic Threshold Low
Input Logic Threshold High
Input Leakage Current
Output Voltage Low
Output Voltage High
Data Rate
Equivalent Input Noise Current
Input Current Sensitivity
Ambient Photodiode Current
Rejection
CC
CC
T1IN, T2IN, TXD,
IRSD....................................................................-0.3V to +6V
R1IN, R2IN .....................................................................±25V
T1OUT, T2OUT............................................................±13.2V
R1OUT, R2OUT, EDGEDET, RXD.........-0.3V to (V
LEDC...................................................................-0.3V to +6V
_______________________________________________________________________________________
to GND ..............................................................-0.3V to +6V
to AV
= AV
to AGND .........................................................-0.3V to +6V
CC
CC
PARAMETER
.......................................................................±0.3V
= 3.0V to 5.5V, GND = AGND = PGND, C1–C4 = 0.1µF (Note 1), T
A
= +25°C and V
RSSD, IRMODE, BAUD16,
CC
= AV
CC
V
T
RSSD = low or IRMODE = low,
T
IRSD = low, T
V
V
V
I
I
(Note 3)
(Note 3)
AV
AV
SINK
SOURCE
A
A
CC
CC
CC
IN
= 3.3V.)
CC
CC
= +25°C (Note 2)
= +25°C (Note 2)
= 0 to V
= 3.3V or 5V, T
= AV
= AV
= 1.6mA
= 3.3V
= 5V
= 1.0mA
CC
CC
CC
CC
= 3.3V
= 5V
A
+ 0.3V)
= +25°C (Note 2)
CONDITIONS
A
= +25°C (Note 2)
Output Short-Circuit Duration (to V
Output Currents
Input Current
Continuous Power Dissipation (T
Operating Temperature Ranges
Storage Temperature Range .............................-65°C to +160°C
Lead Temperature (soldering, 10sec) .............................+300°C
T1OUT, T2OUT .....................................................Continuous
LEDC Continuous ........................................................200mA
LEDC 20% Duty Cycle t
PINC ..............................................................................10mA
SSOP (derate 9.52mW/°C above +70°C) ...................762mW
MAX3130/MAX3131CAI ....................................0°C to +70°C
MAX3130/MAX3131EAI..................................-40°C to +85°C
A
= T
MIN
to T
MAX
0.0002
ON
V
MIN
2.0
2.4
0.6
2.4
CC
, unless otherwise noted. Typical
< 90µs..............................500mA
A
-
CC
= +70°C)
±0.01
or GND)
TYP
0.25
0.01
120
100
375
1.0
0.1
V
10
0.05
CC
-
115.2
MAX
±1.0
200
1.0
1.0
0.8
0.4
10
6
UNITS
nA
kbps
mA
mA
µA
µA
µA
µA
µA
µA
V
V
V
V
RMS

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