MT16JTF25664HZ-1G6G1 Micron Technology Inc, MT16JTF25664HZ-1G6G1 Datasheet
MT16JTF25664HZ-1G6G1
Specifications of MT16JTF25664HZ-1G6G1
Related parts for MT16JTF25664HZ-1G6G1
MT16JTF25664HZ-1G6G1 Summary of contents
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DDR3 SDRAM UDIMM MT16JTF25664AZ – 2GB MT16JTF51264AZ – 4GB Features • DDR3 functionality and operations supported as per component data sheet • 240-pin, unbuffered dual in-line memory module (UDIMM) • Fast data transfer rates: PC3-14900, PC3-12800, PC3-10600, PC3-8500, or PC3-6400 ...
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Table 2: Addressing Parameter Refresh count Row address Device bank address Device page size per bank Device configuration Column address Module rank address Table 3: Part Numbers and Timing Parameters – 2GB 1 Base device: MT41J128M8, 1Gb DDR3 SDRAM Module ...
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Pin Assignments Table 5: Pin Assignments 240-Pin UDIMM Front Pin Symbol Pin Symbol Pin Symbol Pin Symbol Pin Symbol Pin Symbol Pin Symbol Pin Symbol DQ25 61 REFDQ DQ0 ...
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Pin Descriptions The pin description table below is a comprehensive list of all possible pins for all DDR3 modules. All pins listed may not be supported on this module. See Pin Assignments for information specific to this module. Table 6: ...
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Table 6: Pin Descriptions (Continued) Symbol Type SDA I/O TDQSx, Output TDQSx# Err_Out# Output (open drain) EVENT# Output (open drain) V Supply DD V Supply DDSPD V Supply REFCA V Supply REFDQ V Supply SS V Supply TT – NC ...
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DQ Map Table 7: Component-to-Module DQ Map Component Reference Component Number DQ Module ...
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Table 7: Component-to-Module DQ Map (Continued) Component Reference Component Number DQ Module DQ U10 U12 U14 ...
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Functional Block Diagram Figure 2: Functional Block Diagram S1# S0# DQS0# DQS0 DM0 DM DQ0 DQ DQ1 DQ DQ2 DQ DQ3 DQ DQ4 DQ DQ5 DQ DQ6 DQ DQ7 DQS1# DQS1 DM1 DM DQ8 DQ DQ9 ...
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General Description DDR3 SDRAM modules are high-speed, CMOS dynamic random access memory mod- ules that use internally configured 8-bank DDR3 SDRAM devices. DDR3 SDRAM mod- ules use DDR architecture to achieve high-speed operation. DDR3 architecture is essentially a 8n-prefetch architecture ...
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Electrical Specifications Stresses greater than those listed may cause permanent damage to the module. This is a stress rating only, and functional operation of the module at these or any other condi- tions outside those indicated in each device's data ...
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DRAM Operating Conditions Recommended AC operating conditions are given in the DDR3 component data sheets. Component specifications are available on Micron’s Web site. Module speed grades cor- relate with component speed grades, as shown below. Table 10: Module and Component ...
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I Specifications DD Table 11: DDR3 I Specifications and Conditions – 2GB (All Die Revisions) DD Values are for the MT41J128M8 DDR3 SDRAM only and are computed from values specified in the 1Gb (128 Meg x 8) component data sheet ...
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Table 12: DDR3 I Specifications and Conditions – 4GB (Die Revision D) DD Values are for the MT41J256M8 DDR3 SDRAM only and are computed from values specified in the 2Gb (256 Meg x 8) component data sheet Parameter Operating current ...
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Table 13: DDR3 I Specifications and Conditions – 4GB (Die Revision H) DD Values are for the MT41J256M8 DDR3 SDRAM only and are computed from values specified in the 2Gb (256 Meg x 8) component data sheet Parameter Operating current ...
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Table 14: DDR3 I Specifications and Conditions – 4GB (Die Revision M) DD Values are for the MT41J256M8 DDR3 SDRAM only and are computed from values specified in the 2Gb (256 Meg x 8) component data sheet Parameter Operating current ...
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Serial Presence-Detect EEPROM For the latest SPD data, refer to Micron's SPD page: www.micron.com/SPD. Table 15: Serial Presence-Detect EEPROM DC Operating Conditions All voltages referenced to V DDSPD Parameter/Condition Supply voltage Input low voltage: Logic 0; All inputs Input high ...
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Module Dimensions Figure 3: 240-Pin DDR3 UDIMM 0.9 (0.035) TYP 0.50 (0.02) R (4X 0.75 (0.03) R (8X) 2.50 (0.098) D (2X) 2.30 (0.091) TYP PIN 1 2.20 (0.087) TYP 1.45 (0.057) TYP 54.68 (2.15) TYP 15.0 (0.59) ...