STM32TS60ZH6 STMicroelectronics, STM32TS60ZH6 Datasheet - Page 23
STM32TS60ZH6
Manufacturer Part Number
STM32TS60ZH6
Description
Manufacturer
STMicroelectronics
Datasheet
1.STM32TS60ZH6.pdf
(27 pages)
Specifications of STM32TS60ZH6
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
STM32TS60
4
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at www.st.com.
ECOPACK
Figure 6.
1. Drawing is not to scale.
Z
Seating plane
A2
®
®
packages, depending on their level of environmental compliance. ECOPACK
is an ST trademark.
UFBGA144 - 7 x 7 mm ultra low profile fine pitch ball grid array package
outline
A4
X
A3
M
A
Doc ID 16925 Rev 2
e
D1
D
Øb
Ø
Ø
eee M Z
(144 balls)
fff
F
M
Z
Y X
Package mechanical data
A1
F
e
Ball A1
A
E1 E
Y
ddd
Z
A0AS_ME
23/27
®