LTC2951CTS8-1#PBF Linear Technology, LTC2951CTS8-1#PBF Datasheet - Page 17
LTC2951CTS8-1#PBF
Manufacturer Part Number
LTC2951CTS8-1#PBF
Description
Manufacturer
Linear Technology
Datasheet
1.LTC2951CTS8-1PBF.pdf
(20 pages)
Specifications of LTC2951CTS8-1#PBF
Operating Temperature (max)
70C
Operating Temperature (min)
0C
Pin Count
8
Mounting
Surface Mount
Package Type
TSOT-23
Case Length
2.9mm
Screening Level
Commercial
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
2.55 ±0.05
PACKAGE DESCRIPTION
NOTE:
1. DRAWING CONFORMS TO VERSION (WECD-1) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.15 ±0.05
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
0.25 ± 0.05
0.61 ±0.05
(2 SIDES)
2.20 ±0.05
(2 SIDES)
0.50 BSC
0.70 ±0.05
PACKAGE
OUTLINE
(Reference LTC DWG # 05-08-1702 Rev B)
(SEE NOTE 6)
8-Lead Plastic DFN (3mm × 2mm)
TOP MARK
PIN 1 BAR
0.200 REF
DDB Package
3.00 ±0.10
(2 SIDES)
0.75 ±0.05
2.00 ±0.10
(2 SIDES)
LTC2951-1/LTC2951-2
0 – 0.05
R = 0.05
0.56 ± 0.05
(2 SIDES)
TYP
BOTTOM VIEW—EXPOSED PAD
0.25 ± 0.05
R = 0.115
TYP
4
5
2.15 ±0.05
(2 SIDES)
8
1
0.50 BSC
0.40 ± 0.10
PIN 1
R = 0.20 OR
0.25 × 45°
CHAMFER
(DDB8) DFN 0905 REV B
17
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