STM32L152R8H6 STMicroelectronics, STM32L152R8H6 Datasheet - Page 103
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STM32L152R8H6
Manufacturer Part Number
STM32L152R8H6
Description
16/32-BITS MICROS
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet
1.STM32L152-EVAL.pdf
(107 pages)
Specifications of STM32L152R8H6
Core
ARM Cortex M3
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
32MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
51
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
10K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 3.6 V
Data Converters
A/D 20x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-TFBGA
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STM32L152R8H6
Manufacturer:
TI
Quantity:
397
Company:
Part Number:
STM32L152R8H6
Manufacturer:
STMicroelectronics
Quantity:
10 000
STM32L151xx, STM32L152xx
7.2
7.2.1
Thermal characteristics
The maximum chip-junction temperature, T
using the following equation:
Where:
●
●
●
●
P
taking into account the actual V
application.
Table 63.
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org.
Symbol
I/O
JA
max represents the maximum power dissipation on output pins where:
T
P
P
internal power.
P
A
D
INT
I/O
JA
max is the maximum ambient temperature in C,
max is the sum of P
is the package junction-to-ambient thermal resistance, in C/W,
max = (V
Thermal resistance junction-ambient
BGA100 - 7 x 7 mm
Thermal resistance junction-ambient
LQFP100 - 14 x 14 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP64 - 10 x 10 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP48 - 7 x 7 mm / 0.5 mm pitch
Thermal resistance junction-ambient
UFQFPN48 - 7 x 7 mm / 0.5 mm pitch
max is the product of I
Thermal characteristics
OL
× I
OL
T
INT
) + ((V
J
Doc ID 17659 Rev 4
max = T
OL
max and P
DD
Parameter
/ I
and V
DD
OL
A
– V
and V
max + (P
DD
OH
I/O
J
, expressed in Watts. This is the maximum chip
max, in degrees Celsius, may be calculated
OH
) × I
max (P
/ I
OH
D
OH
),
max ×
D
of the I/Os at low and high level in the
max = P
JA
)
INT
Package characteristics
max + P
Value
59
46
45
55
16
I/O
max),
103/107
°C/W
Unit