PIC32MX440F128L-80V/BG Microchip Technology, PIC32MX440F128L-80V/BG Datasheet - Page 206

128 KB Flash, 32 KB RAM, USB-OTG, 80 MHz, 10-Bit ADC, DMA 121 XBGA 10x10x1.20mm

PIC32MX440F128L-80V/BG

Manufacturer Part Number
PIC32MX440F128L-80V/BG
Description
128 KB Flash, 32 KB RAM, USB-OTG, 80 MHz, 10-Bit ADC, DMA 121 XBGA 10x10x1.20mm
Manufacturer
Microchip Technology
Series
PIC® 32MXr
Datasheet

Specifications of PIC32MX440F128L-80V/BG

Processor Series
PIC32MX4xx
Core
MIPS
Data Bus Width
32 bit
Program Memory Type
Flash
Program Memory Size
128 KB
Data Ram Size
32 KB
Interface Type
USB, I2C, UART, RS-232, RS-485, SPI
Maximum Clock Frequency
80 MHz
Number Of Programmable I/os
5
Number Of Timers
5
Operating Supply Voltage
2.3 V to 3.6 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Package / Case
XBGA-121
Operating Temperature Range
- 40 C to + 105 C
Supply Current (max)
10 mA
Core Processor
MIPS32® M4K™
Core Size
32-Bit
Speed
80MHz
Connectivity
I²C, IrDA, LIN, PMP, SPI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
-
Eeprom Size
-
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.3 V ~ 3.6 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 105°C
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC32MX440F128L-80V/BG
Manufacturer:
Microchip Technology
Quantity:
10 000
PIC32MX3XX/4XX
TABLE A-2:
DS61143H-page 206
Section 29.0 “Electrical
Characteristics”
Section 30.0 “Packaging Information” Added the 121-pin XBGA package marking information and package
“Product Identification System”
Section Name
MAJOR SECTION UPDATES (CONTINUED)
Updated the Absolute Maximum Ratings and added Note 3.
Added Thermal Packaging Characteristics for the 121-pin XBGA package
(see Table 29-3).
Updated the conditions for parameters DC20, DC21, DC22 and DC23 in
Table 29-5.
Updated the comments for parameter D321 (C
Updated the SPIx Module Slave Mode (CKE = 1) Timing Characteristics,
changing SP52 to SP35 between the MSb and Bit 14 on SDOx (see
Figure 29-13).
details.
Added the definition for BG (121-lead 10x10x1.1 mm, XBGA).
Added the definition for Speed.
Update Description
© 2011 Microchip Technology Inc.
EFC
) in Table 29-15.

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