MR4A16BCYS35R EverSpin Technologies Inc, MR4A16BCYS35R Datasheet - Page 13

• Manufacturer Part Number: MR4A16BCYS35R
• Description: IC MRAM 16MBIT 35NS 54TSOP
• Manufacturer: EverSpin Technologies Inc
• Series: -r

Specifications of MR4A16BCYS35R

• Format - Memory: RAM
• Memory Type: MRAM (Magnetoresistive RAM)
• Memory Size: 16M (1M x 16)
• Speed: 35ns
• Interface: Parallel
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / Rohs Status: Supplier Unconfirmed

Everspin Technologies © 2010
5. MECHANICAL DRAWING
(DATUM A)
bbb
ddd
Ref
Ref
eee
aaa
D1
DE
A1
E1
SE
fff
A
D
b
E
e
SOLDER BALL DIAMETER REFERS
TO POST REFLOW CONDITION.
THE PRE-REFLOW DIAMETER IS
(DATUM B)
BOTTOM VIEW
1.19
0.22
Min
0.31
Tolerance of, from and position
6
5
4
3
2
1
Nominal
10.00 BSC
10.00 BSC
0.375 BSC
0.375 BSC
5.25 BSC
3.75 BSC
0.75 BSC
1.27
0.27
0.36
0.10
0.10
0.12
0.15
0.08
ø
0.35mm
A
B
C
D
E
F
G
H
PIN A1
INDEX
Figure 5.1 48-FBGA
Max
1.35
0.32
0.41
SEATING PLANE
13
1. Dimensions in Millimeters.
2. The ‘e’ represents the basic solder ball grid pitch.
3. ‘b’ is measurable at the maximum solder ball diameter
4. Dimension ‘ccc’ is measured parallel to primary datum
5. Primary datum C (seating plane) is defined by the
6. Package dimensions refer to JEDEC MO-205 Rev. G.
Document Number: MR4A16B Rev. 5, 4/2010
in a plane parallel to datum C.
C.
crowns
of the solder balls.
Print Version Not To Scale
BOTTOM VIEW
PIN A1
INDEX
MR4A16B