21239 AIM - American Iron and Metal, 21239 Datasheet
21239
Manufacturer Part Number
21239
Description
Solder, Fluxes & Accessories NC254 NO-CLEAN SOLD PASTE 63/37 500 GRAM
Manufacturer
AIM - American Iron and Metal
Datasheet
1.21239.pdf
(3 pages)
Specifications of 21239
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Features:
- Broad Printing Process Window
- Clear Pin-Probe Testable Residue
Description:
NC254 has been developed to offer extremely broad process windows for printing, wetting and pin probe testing. The
superior wetting ability of NC254 results in bright, smooth, shiny, solder joints. NC254 offers very low post process
residues, which remain crystal clear and probable even at the elevated temperatures required for today's lead free alloys.
NC254 has shown to reduce or eliminate voiding under micro-BGAs. NC254 also offers high humidity tolerance and a
chemistry developed for use in air reflow. Slump and humidity tolerances found in NC254 extend the solder pastes useable
life in facilities where environmental control is not at its optimum.
Printing:
Reflow Profile:
Two unique profile families are depicted below; both can be used in ramp-spike or ramp-soak-spike applications, and they
each have similar reflow temperatures. The two profiles differ in where they reach their respective peak temperatures, as
well as the time above liquidus (TAL). The shorter profile of the two would apply to smaller assemblies, where as the longer
profile would apply to larger assemblies, such as backplanes or high-density boards. The shaded area defines the process
window. Oven efficiency, board size/mass, component type and density all influence the final profile for a given assembly.
These profiles are starting points, and processing boards with thermal-couples attached is recommended to optimize the
process.
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Apply sufficient paste to the stencil to allow a smooth, even roll during the print cycle (a bead diameter of 12 to 16
mm (½ to ⅝ inch) is normally sufficient to begin).
Apply small amounts of fresh solder paste to the stencil at controlled intervals to maintain paste chemistry and
workable properties.
NC254 provides the necessary tack time and force for today’s high speed placement equipment, which will enhance
product performance and reliability.
Cleaning of your stencil will vary by application, however, it can be accomplished using AIM 200AX-10 stencil
cleaner.
Snap-off distance = on contact 0.00 mm (0.00”)
PCB Separation Distance = 0.75-2.0 mm (.030-.080”)
PCB Separation Speed = Slow
Squeegee Pressure = 0.10-0.30 kg/cm (.6 -1.7 lbs/in.) of blade
Squeegee Stroke Speed = 12-150 mm/sec. (.5 - 6 in./sec.)
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Note: Recommended initial printer settings above are dependent on PCB and pad design
No-Clean Pin Probe Testable Solder Paste
Sn62 and Sn63
- Reduces Voiding under Micro-BGAs
- 12-14 Hour Tack Time
NC254
- 24 Hour Stencil Life
- Excellent Wetting
21239 Summary of contents
Page 1
Features: - Broad Printing Process Window - Clear Pin-Probe Testable Residue Description: NC254 has been developed to offer extremely broad process windows for printing, wetting and pin probe testing. The superior wetting ability of NC254 results in bright, smooth, shiny, ...
Page 2
RATE OF RAMP TO PROGRESS RISE 1.5-2°C / 150°C THROUGH SEC MAX (302°F) 150°C-170°C (302°F-338°F) Short Profiles ≤ 75 Sec Long Profiles ≤ 90 Sec T HE RECOMMENDED REFLOW PROFILE FOR , LAYOUT OR OTHER PROCESS VARIABLES ...
Page 3
Test Data Summary: CLASSIFICATION Product Name IPC Classification to J-STD-004 NC254 REL0 POWDER TESTING No. Item 1 Powder Size 2 Powder Shape FLUX MEDIUM TESTING No. Item 1 Acid Value 2 Halide Content 3 Fluorides Spot Test 4 Corrosivity Test/ ...