NCP346SN2T1G ON Semiconductor, NCP346SN2T1G Datasheet - Page 14

• Manufacturer Part Number: NCP346SN2T1G
• Description: Supervisory Circuits 5.5V Overvoltage Supervisor
• Manufacturer: ON Semiconductor

Specifications of NCP346SN2T1G

• Number Of Voltages Monitored: 1
• Monitored Voltage: 5.5 V
• Overvoltage Threshold: Adjustable, 4.55 V
• Output Type: PFET Driver
• Manual Reset: Resettable
• Watchdog: No Watchdog
• Supply Voltage (max): 25 V
• Supply Voltage (min): 2.5 V
• Supply Current (typ): 650 uA
• Maximum Power Dissipation: 216 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: SOT-23-5 Thin (TSOP-5)
• Minimum Operating Temperature: - 40 C
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

of the pad size. This can vary from the minimum pad size for
soldering to a pad size given for maximum power
dissipation. Power dissipation for a surface mount device is
determined by T
temperature of the die, R
device junction to ambient, and the operating temperature,
T
Thin SOT−23−5 package, P
A
The power dissipation of the Thin SOT−23−5 is a function
. Using the values provided on the data sheet for the
J(max)
P
D
qJA
+
, the maximum rated junction
, the thermal resistance from the
T
D
J(max)
can be calculated as follows:
R
qJA
–T
A
THIN SOT−23−5 POWER DISSIPATION
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NCP346
14
ratings table on the data sheet. Substituting these values into
the equation for an ambient temperature T
calculate the power dissipation of the device which in this
case is 400 milliwatts.
the use of the recommended footprint on a glass epoxy
printed circuit board to achieve a power dissipation of
417mw.
The values for the equation are found in the maximum
The 300°C/W for the Thin SOT−23−5 package assumes
P
D
+ 150°C – 25°C
300°C W
+ 417 milliwatts
A
of 25°C, one can