HIN202CB Intersil, HIN202CB Datasheet - Page 17

no-image

HIN202CB

Manufacturer Part Number
HIN202CB
Description
IC TXRX RS-232 5V 16-SOIC
Manufacturer
Intersil
Type
Transceiverr
Datasheets

Specifications of HIN202CB

Number Of Drivers/receivers
2/2
Protocol
RS232
Voltage - Supply
4.5 V ~ 5.5 V
Mounting Type
Surface Mount
Package / Case
16-SOIC (0.300", 7.5mm Width)
Application
Any system requiring RS-232 communications port, computer-portable, mainframe, laptop, peripheral-printers and terminals, instrumentation, modems
Current, Input
5
Data Rate
120
Impedance, Input
3 to 7 Kiloohms
Number Of Circuits
2 Transmitters, 2 Receivers
Package Type
SOIC
Slew Rate
30 Vus (Typ.)
Standards
Meet all ElA RS-232E and V.28 Specifications
Transceiver Type
RS-232
Voltage, Input
5 V
Voltage, Output Swing
±10 V
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HIN202CB
Manufacturer:
INTERSIL
Quantity:
1 031
Part Number:
HIN202CB
Manufacturer:
INTERSIL
Quantity:
1 000
Part Number:
HIN202CB
Manufacturer:
INTERSIL
Quantity:
20 000
Part Number:
HIN202CB-T
Manufacturer:
YAMA
Quantity:
296
Part Number:
HIN202CB-T
Manufacturer:
INTERSIL
Quantity:
5 054
Part Number:
HIN202CB-T
Manufacturer:
INTERSIL
Quantity:
20 000
Part Number:
HIN202CBN
Manufacturer:
INTERSIL
Quantity:
1 000
Part Number:
HIN202CBN
Manufacturer:
INTERSIL
Quantity:
20 000
Part Number:
HIN202CBN-T
Manufacturer:
INTERSIL
Quantity:
12 500
Part Number:
HIN202CBN-T
Manufacturer:
INTERSIL
Quantity:
14 707
Part Number:
HIN202CBNZ
Manufacturer:
Intersil
Quantity:
5 905
Part Number:
HIN202CBNZ
Manufacturer:
INTERSIL
Quantity:
20 000
Company:
Part Number:
HIN202CBNZ
Quantity:
7 500
Part Number:
HIN202CBNZ-T
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
Shrink Small Outline Plastic Packages (SSOP)
NOTES:
10. Controlling dimension: MILLIMETER. Converted inch dimensions
N
1
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
5. The chamfer on the body is optional. If it is not present, a visual index
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable dambar
0.25(0.010)
Publication Number 95.
Mold flash, protrusion and gate burrs shall not exceed 0.20mm
(0.0078 inch) per side.
lead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per
side.
feature must be located within the crosshatched area.
protrusion shall be 0.13mm (0.005 inch) total in excess of “B” dimen-
sion at maximum material condition.
are not necessarily exact.
2
-A-
INDEX
AREA
3
e
B
D
M
C A
SEATING PLANE
M
-C-
E
-B-
B S
A
17
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
H
A1
µ
α
0.10(0.004)
0.25(0.010)
GAUGE
PLANE
0.010
A2
0.25
M
B
M
L
C
M24.209
24 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
A1
A2
C
D
H
N
α
A
B
E
e
L
(JEDEC MO-150-AG ISSUE B)
0.002
0.065
0.009
0.004
0.312
0.197
0.292
0.022
MIN
0
-
0.026 BSC
o
INCHES
24
-
MAX
0.078
0.072
0.014
0.009
0.334
0.220
0.322
0.037
8
o
MILLIMETERS
0.05
1.65
0.22
0.09
7.90
5.00
7.40
0.55
MIN
0
-
o
0.65 BSC
24
MAX
2.00
1.85
0.38
0.25
8.50
5.60
8.20
0.95
8
-
o
Rev. 1 3/95
NOTES
9
3
4
6
7
-
-
-
-
-
-
-

Related parts for HIN202CB