24LC16B-I/MS Microchip Technology Inc., 24LC16B-I/MS Datasheet - Page 4

• Manufacturer Part Number: 24LC16B-I/MS
• Description: 16K, 2K X 8 2.5V SERIAL EE, IND
• Manufacturer: Microchip Technology Inc.

Specifications of 24LC16B-I/MS

• Capacitance, Input: 10 pF
• Capacitance, Output: 10 pF
• Current, Input, Leakage: ±1 μA
• Current, Operating: 0.01 mA (Read), 3 mA (Write)
• Current, Output, Leakage: ±1
• Data Retention: >200 yrs.
• Density: 16K
• Interface: 2-Wire
• Memory Type: Serial EEPROM
• Organization: 256×8
• Package Type: MSOP
• Temperature, Operating: -40 to +85 °C
• Time, Access: 900 ns
• Time, Fall: 300 ns
• Time, Rise: 300 ns
• Voltage, Esd: ≥4 kV
• Voltage, Input, High: 1.75 V
• Voltage, Input, Low: 0.75 V
• Voltage, Output, Low: 0.4 V
• Voltage, Supply: 2.5 to 5.5 V
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

24AA16/24LC16B
DS21703G-page 18
8-Lead Plastic Micro Small Outline Package (MS or UA) [MSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
1
N
b
2
D
e
E1
A2
Dimension Limits
E
c
Units
A1
E1
A2
L1
N
A
E
D
e
L
φ
c
b
0.75
0.00
0.40
0.08
0.22
MIN
0°
–
L1
MILLIMETERS
0.65 BSC
4.90 BSC
3.00 BSC
3.00 BSC
0.95 REF
NOM
0.85
0.60
8
–
–
–
–
–
Microchip Technology Drawing C04-111B
© 2007 Microchip Technology Inc.
MAX
1.10
0.95
0.15
0.80
0.40
0.23
8°
L
φ