8111 AIM Solder, 8111 Datasheet
8111
Manufacturer Part Number
8111
Description
ONE-STEP Underfill 688; 10 cc; No-Flow Underfill Flip Chip; CSP; BGA; and MICRO-BGA
Manufacturer
AIM Solder
Datasheet
1.8111.pdf
(3 pages)
Specifications of 8111
Color
Purple when not cured Clear when cured
Physical State
Liquid
Special Features
Flows at 120°C — 140°C
Specific Gravity
1.27 g/cc
Temperature Range
Maximum at 255°C
Time, Setting
Up to 150°C — ≤ 75 seconds, From 150°C to 175°C — 30-60 seconds, Peak Temperature 235°C to 250°C — 60 seconds
Volatile
total is < 1%
Lead Free Status / Rohs Status
RoHS Compliant part
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
81113D-1Y
Manufacturer:
SAMKYUNG
Quantity:
660
Part Number:
8111LP8L
Manufacturer:
HARUTO
Quantity:
20 000
Features
Description
One-Step Underfill 688 is a non-odorous, low surface tension, one component epoxy resin designed as a one-step
no-flow underfill for flip chip, CSP, BGA and micro-BGA assemblies. One-Step Underfill 688 improves product
reliability through high Tg, low CTE, and good fill with no voiding. Even though One-Step Underfill 688 does not
require flux, it is compatible with no-clean flux residues and provides excellent adhesion. One-Step Underfill 688
can be dispensed directly following solder paste printing, after which components are placed and the entire
assembly is reflowed and cured simultaneously in a standard lead-free reflow process. This eliminates the need for
a second assembly process and separate cure cycle. The result of this is faster throughput and higher yields that are
achieved in one step through excellent capillary action, fast reflow characteristics, and rapid cure speeds. One-Step
Underfill 688 may be reworked at 120° C and the viscosity of the product remains stable through out its shelf life.
This product wets solder to OSP, ENIG, immersion silver, and immersion tin board surfaces.
Formed with One-Step Underfill 688
Application
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- Flux Action to Form Solder Connections
- Compatible with No-Clean Flux Residues
- Odorless During Printing and Curing
- Reworkable at 120° C (248° F)
Curing: Standard lead-free solder profile (RSS), maximum temperature 255° C (491° F).
Rework: Flows at 120° C – 140° C (248° F – 284° F).
Print your solder paste, dispense One-Step Underfill 688, place the components, and finally reflow all in one
assembly line. One-Step Underfill 688 is designed to solder on its own without the need for solder paste.
The dispense pattern for small die applications 6.35mm (.25”) is typically single center dot only, with no
secondary dispense or final perimeter bead required. Ensure that all pads are covered with One-Step Underfill
688.
The low viscosity and excellent wetting characteristics of the product allow the material to “self-fillet” along
the edges of the die. For larger pads, multiple dots or x patterns may be required to ensure that all pads are
covered.
The dispense pattern for larger die applications is typically dot pattern from the center out. Since the product
improves solder wetting there is no need to avoid solder pads. Cover all pads to be soldered to on the board and
place the component.
One-Step Underfill 688 is reworkable by heat. The suggested rework procedure is to heat the part to be
removed to its standard reflow temperature and removing it with a flat spatula. Using a soldering wick and a
soldering iron, soak up excessive epoxy. Scrub the pads clean, and if necessary, clean with a small amount of
solvent, such as methyl ethyl ketone or isopropryl alcohol.
One-Step Underfill 688
Underfill
- Cures in Lead-Free Profile
- Eliminates the Need for a Cure Cycle
- Eliminates Voiding
- Non-Hygroscopic
8111 Summary of contents
Page 1
One-Step Underfill 688 Features - Flux Action to Form Solder Connections - Compatible with No-Clean Flux Residues - Odorless During Printing and Curing - Reworkable at 120° C (248° F) Description One-Step Underfill 688 is a non-odorous, low surface tension, ...
Page 2
Recommended Dispense Pattern Recommended Reflow Profile RATE OF RAMP TO PROGRESS RISE 2°C / 150°C THROUGH SEC MAX (302°F) 150°C-175°C (302°F-347°F) ≤ 75 30-60 SECONDS SECONDS Physical Properties Appearance CTE (before Tg) CTE (after Tg) Tg Total Volatiles Specific Gravity ...
Page 3
Surface Insulation Resistance Reference IPC-TM-650 method 2.6.3.3. §5.5.1. J-STD-004 § 3.2.4.5.1. IPC-TM-650 method Electromigration Test Electromigration Handling and Storage - One-Step Underfill 688 has a work life of 2 months at 5° months at 0°C. - One-Step Underfill ...