ISP1105BSTS ST-Ericsson Inc, ISP1105BSTS Datasheet - Page 29

• Manufacturer Part Number: ISP1105BSTS
• Description: IC TXRX SERIAL BUS ADV 16HVQFN
• Manufacturer: ST-Ericsson Inc
• Type: Transceiverr

Specifications of ISP1105BSTS

• Number Of Drivers/receivers: 1/1
• Protocol: USB 2.0
• Voltage - Supply: 4 V ~ 5.5 V
• Mounting Type: Surface Mount
• Package / Case: 16-VQFN Exposed Pad, 16-HVQFN, 16-SQFN, 16-DHVQFN
• For Use With: ISP1105BS EVAL KIT - EVAL KIT FOR NXP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: ISP1105BS-G; ISP1105BS-G

Philips Semiconductors
Contents
1
2
3
4
4.1
5
6
6.1
6.2
7
7.1
7.2
7.3
7.4
8
8.1
8.2
9
10
11
12
13
14
15
16
16.1
16.2
16.3
16.4
16.5
17
17.1
17.2
18
19
20
21
© Koninklijke Philips Electronics N.V. 2004.
Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 19 February 2004
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 7
Electrostatic discharge (ESD). . . . . . . . . . . . . 10
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 11
Recommended operating conditions. . . . . . . 11
Static characteristics. . . . . . . . . . . . . . . . . . . . 12
Dynamic characteristics . . . . . . . . . . . . . . . . . 15
Test information . . . . . . . . . . . . . . . . . . . . . . . . 17
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18
Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Additional soldering information . . . . . . . . . . 25
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 26
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 27
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
Function selection. . . . . . . . . . . . . . . . . . . . . . . 7
Operating functions. . . . . . . . . . . . . . . . . . . . . . 7
Power supply configurations . . . . . . . . . . . . . . . 8
Power supply input options . . . . . . . . . . . . . . . . 9
ESD protection . . . . . . . . . . . . . . . . . . . . . . . . 10
ESD test conditions . . . . . . . . . . . . . . . . . . . . 10
Introduction to soldering surface mount
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 22
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 22
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 23
Package related soldering information . . . . . . 23
(H)BCC packages: footprint . . . . . . . . . . . . . . 25
(H)BCC packages: reflow soldering profile. . . 25
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Document order number: 9397 750 11231
Advanced USB transceivers
ISP1105/1106