MCP2150-I/SS Microchip Technology Inc., MCP2150-I/SS Datasheet - Page 43
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MCP2150-I/SS
Manufacturer Part Number
MCP2150-I/SS
Description
IRDA PROTOCOL HANDLER PLUS ENDEC FOR DTE APPS
Manufacturer
Microchip Technology Inc.
Datasheet
1.MCP2150-ISS.pdf
(52 pages)
Specifications of MCP2150-I/SS
Lead Free Status / Rohs Status
RoHS Compliant part
Electrostatic Device
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCP2150-I/SS
Manufacturer:
VISHAY
Quantity:
7 011
Part Number:
MCP2150-I/SS
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
18-Lead Plastic Small Outline (SO) – Wide, 300 mil (SOIC)
2002 Microchip Technology Inc.
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-051
B
c
p
n
45
Dimension Limits
E1
E
h
Units
A2
E1
A1
D
n
p
A
E
h
L
B
c
2
1
MIN
L
.093
.088
.004
.394
.446
.010
.016
.009
.014
D
.291
0
0
0
Preliminary
INCHES*
NOM
.050
.099
.008
.407
.295
.454
.020
.033
.017
.091
.011
A
18
12
12
A1
4
MAX
.104
.094
.012
.420
.299
.462
.029
.050
.012
.020
15
15
8
MIN
11.33
10.01
2.36
2.24
0.10
7.39
0.25
0.23
0.36
0.41
0
0
0
MILLIMETERS
NOM
10.34
11.53
1.27
2.50
0.20
7.49
0.50
0.84
0.27
0.42
2.31
18
12
12
4
MAX
MCP2150
10.67
11.73
A2
2.64
2.39
0.30
7.59
0.74
1.27
0.30
0.51
15
15
8
DS21655B-page 43