LM158AH National Semiconductor, LM158AH Datasheet - Page 2

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LM158AH

Manufacturer Part Number
LM158AH
Description
Amplifier; 32 V; 50; 32; 550 mW; 1 mV (Typ.); 2 nA (Typ.); 20 nA (Typ.); -55 de
Manufacturer
National Semiconductor
Datasheet

Specifications of LM158AH

Amplifier Type
Low Offset Voltage, Low Power
Bandwidth
1 MHz
Channel Separation
-120
Common Mode Rejection Ratio
85
Current, Input Bias
20 nA
Current, Input Offset
2 nA
Current, Offset, Input
2 nA (Typ.)
Current, Output
40 mA
Current, Supply
0.5 mA
Number Of Amplifiers
Dual
Package Type
TO-5
Power Dissipation
550 mW
Slew Rate
0.5
Temperature, Operating, Maximum
125 °C
Temperature, Operating, Minimum
-55 °C
Temperature, Operating, Range
-55 to +125 °C
Voltage, Differential Input
32
Voltage, Gain
100 V/mV
Voltage, Input
-0.3 to +32 V
Voltage, Offset
1 mV
Voltage, Offset, Input
1 mV (Typ.)
Voltage, Output, High
28 V
Voltage, Output, Low
5 mV
Voltage, Supply
5 V

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LM158AH
Manufacturer:
NS/国半
Quantity:
20 000
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Manufacturer:
TOKO
Quantity:
76 000
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LM158AH/883
Manufacturer:
WSI
Quantity:
125
Part Number:
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Manufacturer:
NS
Quantity:
16
Part Number:
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Manufacturer:
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Quantity:
335 000
Part Number:
LM158AH/883Q
Manufacturer:
TI
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1 010
Part Number:
LM158AH/NOPB
Manufacturer:
National Semiconductor
Quantity:
135
Input Offset Voltage
Input Bias Current
Input Offset Current
Input Common-Mode
Voltage Range
Supply Current
Absolute Maximum Ratings
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Electrical Characteristics
V
Supply Voltage, V
Differential Input Voltage
Input Voltage
Power Dissipation (Note 1)
Output Short-Circuit to GND
Input Current (V
Operating Temperature Range
Storage Temperature Range
Lead Temperature, DIP
Lead Temperature, Metal Can
Soldering Information
ESD Tolerance (Note 10)
+
Molded DIP
Metal Can
Small Outline Package (M)
micro SMD
(One Amplifier) (Note 2)
V
LM358
LM258
LM158
(Soldering, 10 seconds)
(Soldering, 10 seconds)
Dual-In-Line Package
Small Outline Package
See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of soldering
surface mount devices.
= +5.0V, unless otherwise stated
+
Parameter
Soldering (10 seconds)
Vapor Phase (60 seconds)
Infrared (15 seconds)
≤ 15V and T
IN
+
A
<
= 25˚C
−0.3V) (Note 3)
(Note 5), T
I
V
I
V
(LM2904, V
Over Full Temperature Range
R
V
V
IN(+)
IN(+)
CM
+
+
+
L
= 30V, (Note 7)
= 30V (LM2904 V
= 5V
=
= 0V, (Note 6)
or I
− I
IN(−)
on All Op Amps
IN(−)
A
+
, V
, T
= 25˚C
Conditions
= 26V), T
CM
A
= 25˚C,
= 0V, T
+
A
= 26V)
(Note 9)
= 25˚C
A
= 25˚C
2
Min Typ
0
Distributors for availability and specifications.
LM158A/LM258A/LM358A
LM158A
LM158/LM258/LM358
0.5
20
1
2
1
−55˚C to +125˚C
−65˚C to +150˚C
−25˚C to +85˚C
−0.3V to +32V
0˚C to +70˚C
V
Continuous
Max
+
830 mW
550 mW
530 mW
1.2
50
10
435mW
−1.5
50 mA
2
2
260˚C
300˚C
260˚C
215˚C
220˚C
250V
32V
32V
Min Typ
0
LM358A
0.5
45
2
5
1
V
+
Max
100
1.2
30
−1.5
3
2
Min Typ
LM158/LM258
0
−65˚C to +150˚C
−40˚C to +85˚C
−0.3V to +26V
0.5
45
2
3
1
Continuous
830 mW
530 mW
LM2904
50 mA
260˚C
300˚C
260˚C
215˚C
220˚C
250V
V
26V
26V
+
Max
150
1.2
30
−1.5
5
2
Units
mV
mA
mA
nA
nA
V

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