8ETH03SPBF Vishay PCS, 8ETH03SPBF Datasheet - Page 4

• Manufacturer Part Number: 8ETH03SPBF
• Description: Diode, Ultrafast, 300V 8A, D2-PAK
• Manufacturer: Vishay PCS

Specifications of 8ETH03SPBF

• Capacitance, Junction: 31 pF
• Configuration: Single
• Current, Forward: 8 A
• Current, Surge: 100 A
• Package Type: D2PAK
• Primary Type: Rectifier
• Resistance, Thermal, Junction To Case: 2.5 °C/W
• Speed, Switching: Hyperfast
• Temperature, Junction, Maximum: +175 °C
• Temperature, Operating: -65 to +175 °C
• Time, Recovery: 35 ns
• Voltage, Forward: 1 V
• Voltage, Reverse: 300 V
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

DIMENSIONS FOR D
Notes
(1)
(2)
(3)
(4)
(5)
(6)
(7)
Conforms to JEDEC outline D
Lead assignments
Diodes
1. - Anode (two die)/open (one die)
2., 4. - Cathode
3. - Anode
(3)
SYMBOL
D
L2
Dimensioning and tolerancing per ASME Y14.5 M-1994
Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at
the outmost extremes of the plastic body
Thermal pad contour optional within dimension E, L1, D1 and E1
Dimension b1 and c1 apply to base metal only
Datum A and B to be determined at datum plane H
Controlling dimension: inch
Outline conforms to JEDEC outline TO-263AB
L1
A1
b1
b2
b3
c1
c2
A
D
b
c
2 x
B
e
1
B
(2)(3)
MILLIMETERS
MIN.
0.00
0.51
0.38
1.14
4.06
0.51
1.14
1.14
0.38
8.51
E
2
4
3
MAX.
0.254
4.83
0.99
0.89
1.78
1.73
0.74
0.58
1.65
9.65
2 x b
2 x b2
2
0.010
H
PAK (SMD-220)
2
A
(2)
PAK in millimeters and inches
M
C
0.160
0.000
0.020
0.045
0.045
0.015
0.015
0.045
0.335
0.020
Lead tip
MIN.
Detail A
A
M
INCHES
B
MAX.
0.190
0.010
0.039
0.035
0.070
0.068
0.029
0.023
0.065
0.380
0° to 8°
± 0.004
c
Gauge
plane
L3
A
D
c2
NOTES
M
2
PAK, TO-262
4
4
4
2
B
A A
A
B
L
Rotated 90 °CW
L4
Scale: 8:1
Detail “A”
SYMBOL
View A - A
D1
E1
L1
L2
L3
L4
H
E
e
L
(E)
E1
A1
H
14.61
MILLIMETERS
MIN.
6.86
9.65
6.22
1.78
1.27
4.78
Vishay High Power Products
-
2.54 BSC
0.25 BSC
(3)
(D1)
B
Outline Dimensions
Seating
(3)
plane
MAX.
10.67
15.88
2.79
1.65
1.78
5.28
-
-
Plating
15.00 (0.625)
(0.08)
17.90 (0.70)
2.32
2.64 (0.103)
2.41 (0.096)
(c)
0.270
0.380
0.245
0.575
0.070
0.050
0.188
MIN.
MIN.
Section B - B and C - C
-
0.100 BSC
0.010 BSC
INCHES
Scale: None
Pad layout
(0.43)
11.00
(b, b2)
b1, b3
(4)
MAX.
0.420
0.625
0.110
0.066
0.070
0.208
MIN.
-
-
(0.15)
3.81
(0.38)
9.65
NOTES
c1
2, 3
(4)
MIN.
Base
Metal
3
3
3
MIN.
1