LTC2856IMS8-2#TRPBF Linear Technology, LTC2856IMS8-2#TRPBF Datasheet - Page 16
![IC TXRX RS485/RS422 8-MSOP](/photos/6/57/65743/8-msop_05-08-1660_sml.jpg)
LTC2856IMS8-2#TRPBF
Manufacturer Part Number
LTC2856IMS8-2#TRPBF
Description
IC TXRX RS485/RS422 8-MSOP
Manufacturer
Linear Technology
Type
Transceiverr
Datasheet
1.LTC2856CMS8-2PBF.pdf
(20 pages)
Specifications of LTC2856IMS8-2#TRPBF
Number Of Drivers/receivers
1/1
Protocol
RS422, RS485
Voltage - Supply
4.5 V ~ 5.5 V
Mounting Type
Surface Mount
Package / Case
8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
LTC2857-1/LTC2857-2
LTC2858-1/LTC2858-2
PACKAGE DESCRIPTION
16
3.5 0.05
2.15 0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
TOP MARK
1.65 0.05
(2 SIDES)
(NOTE 6)
0.25 0.05
PIN 1
0.200 REF
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
ON TOP AND BOTTOM OF PACKAGE
2.38 0.05
(2 SIDES)
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
0.50
BSC
DD Package
0.675 0.05
0.75 0.05
3.00 0.10
(4 SIDES)
PACKAGE
OUTLINE
0.00 – 0.05
1.65 0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
0.25 0.05
R = 0.115
TYP
4
5
2.38 0.10
(2 SIDES)
8
1
0.50 BSC
0.38 0.10
(DD) DFN 1203
285678fe