21486 AIM Solder, 21486 Datasheet

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21486

Manufacturer Part Number
21486
Description
NC257MD No Clean, SN 63, for MYDATA MY500 Jet Printer
Manufacturer
AIM Solder
Datasheet
1.21486.pdf (2 pages)

Specifications of 21486

Alloy
Sn63/Pb37
Color
Gray, Smooth, Creamy
Melting, Point
217°C to 218°C
Odor
Typical rosin
Physical State
Solid
Primary Type
Solder Paste
Shelf Life
At 4°C - 12°C — 6 months
Special Features
12 - 14 Hour Tack Time
Time, Setting
Low Density Boards to 150°C — 75 seconds, from 150°C to 175°C — 30-60 seconds, Peak 230° to 245C — 45-75 seconds High Density Boards to 150°C — 90 seconds, from 150°C to 175°C — 60-90 seconds, Peak 230° to 245C — 45-75 seconds
Viscosity
Suitable for MY500 Jet Printers
Features:
- Designed for MyData MY500 Jet Printer
- Clear Pin-Probe Testable Residue
Description:
NC257MD solder paste has been specifically designed for the MyData MY500 Jet Printer. Its unique rheological properties
were engineered and validated through extensive testing to provide continuous and consistent deposits. NC257MD provides
the necessary tack time and force for today’s high speed placement equipment, which will enhance product performance and
reliability. The superior wetting ability of NC257MD results in bright, smooth and shiny solder joints. It also offers very
low post process residues, which remain crystal clear and easily probed even at the elevated temperatures required for
today’s lead-free alloys.
Dispensing:
-
Reflow Profile:
Two unique profile families are depicted below; both can be used in ramp-spike or ramp-soak-spike applications, and they
each have similar reflow temperatures. The two profiles differ in where they reach their respective peak temperatures, as
well as the time above liquidus (TAL). The shorter profile of the two would apply to smaller assemblies, where as the longer
profile would apply to larger assemblies, such as backplanes or high-density boards. The shaded area defines the process
window. Oven efficiency, board size/mass, component type and density all influence the final profile for a given assembly.
These profiles are starting points, and processing boards with thermal-couples attached is recommended to optimize the
process.
RATE OF
RISE 2°C /
SEC MAX
Short Profiles
Long Profiles
Supplied in Iwashita 30cc syringes which are labeled with the standard MY500 Jet Printer bar code for easy product
recognition that will automatically set machine jetting parameters.
THE RECOMMENDED REFLOW PROFILE FOR
LAYOUT
THE REFLOW PROFILE FOR THE
RAMP TO
150°C
(302°F)
,
OR OTHER PROCESS VARIABLES
≤ 75 Sec
≤ 90 Sec
PROGRESS
THROUGH
150°C-175°C
(302°F-347°F)
30-60 Sec
60-90 Sec
SnAgCu
.
CONTACT
NC257MD
PASTES USING A VAPOR PHASE REFLOW OVEN
Lead-Free No Clean Solder Paste
- Reduces Voiding Under Micro-BGAs
NC257MD
- Excellent Wetting, Even Leadless Devices
AIM
TO PEAK
TEMP 230°C-
245°C (445°F-
474°F)
IS PROVIDED AS A GUIDELINE
SAC305
TECHNICAL SUPPORT IF YOU REQUIRE ADDITIONAL PROFILING ASSISTANCE
45-75 Sec
45-75 Sec
TIME ABOVE
217°C (425°F)
30-60 Sec
60-90 Sec
.
OPTIMAL PROFILE MAY DIFFER DUE TO OVEN TYPE
:
PEAK TEMPERATURE RANGE IS
COOLDOWN
≤ 4 °C / SEC
45± 15 Sec
45± 15 Sec
- 12-14 Hour Tack Time
- Vapor Phase Compatible
230°C – 245°C.
PROFILE
LENGTH
AMBIENT TO
PEAK
2.75-3.5 Min
4.5-5.0 Min
.
,
ASSEMBLY

21486 Summary of contents

Page 1

Features: - Designed for MyData MY500 Jet Printer - Clear Pin-Probe Testable Residue Description: NC257MD solder paste has been specifically designed for the MyData MY500 Jet Printer. Its unique rheological properties were engineered and validated through extensive testing to provide ...

Page 2

NC257MD Compatible Products: AIM Lead-Free Electropure Solder Bar - NC264-5 No-Clean Flux Spray/Foam - NC270WR VOC-Free No-Clean Spray Flux - Cleaning: NC257MD can be cleaned if necessary with saponified water or an appropriate solvent cleaner. - Please refer to the ...