25LC256-I/ST Microchip Technology Inc., 25LC256-I/ST Datasheet - Page 5

• Manufacturer Part Number: 25LC256-I/ST
• Description: 256K, 32K X 8 , 2.5V SER EE IND
• Manufacturer: Microchip Technology Inc.

Specifications of 25LC256-I/ST

• Capacitance, Input: 7 pF
• Capacitance, Output: 7 pF
• Current, Input, Leakage: ±1 μA
• Current, Operating: 2.5 mA (Read), 0.6 mA (Write)
• Current, Output, Leakage: ±1
• Data Retention: >200 yrs.
• Density: 256K
• Interface: SPI Bus
• Memory Type: Serial EEPROM
• Organization: 32768×8
• Package Type: TSSOP
• Temperature, Operating: -40 to +85 °C
• Time, Access: 50 ns
• Time, Address Hold: 200
• Time, Address Setup: 100
• Time, Fall: 100 ns
• Time, Rise: 100 ns
• Voltage, Esd: >4 kV
• Voltage, Input, High: 3.5 V
• Voltage, Input, Low: 0.75 V
• Voltage, Output, High: 2 V
• Voltage, Output, Low: 0.2 V
• Voltage, Supply: 2.5 to 5.5 V
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

© 2007 Microchip Technology Inc.
8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
NOTE 1
A
A1
b
N
1
2
D
e
Dimension Limits
A2
E1
c
E
Units
A2
A1
E1
L1
N
E
D
e
A
L
b
φ
c
L1
MIN
0.80
0.05
4.30
2.90
0.45
0.09
0.19
0°
–
25AA256/25LC256
MILLIMETERS
0.65 BSC
6.40 BSC
1.00 REF
NOM
1.00
4.40
3.00
0.60
8
–
–
–
–
–
Microchip Technology Drawing C04-086B
L
MAX
1.20
1.05
0.15
4.50
3.10
0.75
0.20
0.30
8°
φ
DS21822F-page 19