CLF8 Chemtronics, CLF8 Datasheet

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CLF8

Manufacturer Part Number
CLF8
Description
Chemical, Solder Mask, Lead Free, 8 oz, Sqeeze Bottle
Manufacturer
Chemtronics
Type
Solder Maskr
Datasheet

Specifications of CLF8

Chemical Component
Acrylic Polymer/Ammonium Hydroxide/Methanol/Polyisoprene Emulsion (Latex)/Titanium Dioxide/Trimethyl Quinoline Homopolymer/Zinc Dibutyl Dithiocarbamate
Dispensing Method
Bottle
Primary Type
Coating
Temperature, Rating
+550 °F
Time, Setting
15 min.
Weight
8 Oz.
Lead Free Status / Rohs Status
RoHS Compliant part
PRODUCT DESCRIPTION
Chemask
is a temporary, fast curing, peelable solder
masking agent formulated for use in high
temperature lead-free applications. It is a
temperature resistant coating that protects
component-free areas of the PCB during
wave soldering. Chemask
introduced into the preheat oven within 4
minutes of application without adverse
effects. Use to protect pins, posts, contacts
and edge connections during conformal
coating processes.
TYPICAL APPLICATIONS
Chemask
protects:
CHEMTRONICS
Technical Data Sheet
Stable to 550°F (288°C)
Can be used in lead-free or Tin/Lead
applications
Compatible with rosin, no clean, and
water soluble fluxes
Unaffected by cleaning solvents
Leaves no residue – non-contaminating
Ready for wave solder in 4 minutes
Dries tack free in 15 minutes
RoHS compliant
Component Free Areas for Soldering
Components and Sockets
Pin Connectors During Soldering
Temperature Sensitive Components
During Wave Soldering
Chemask
®
®
Lead-Free Solder Masking Agent
Lead-Free Solder Masking Agent
®
®
®
Lead-Free can be
Lead-Free Solder Masking Agent
TYPICAL PRODUCT DATA AND
PHYSICAL PROPERTIES
Base Material
Color
Solvent Stability
Flux Compatibility
Temperature Stability
Tack-Free Drying Time
(10 mils @ 77°F)
Cure Time
(10 mils @ 77°F)
Viscosity (@ 77°F)
(± 10,000 cps)
Viscosity Adjusted With
Solids Content
Flash Point
Weight/Gallon
Shelflife
RoHS/WEEE
Status
COMPATIBILITY
Chemask
is generally compatible with most materials
used in printed circuit board fabrication. As
with any solder masking agent, compatibility
with substrate must be determined on a non-
critical area prior to use. Test compatibility
on bare copper.
(cured mask)
®
Lead-Free Solder Masking Agent
hydrofluorocarbon, chlorinated,
Stable in all hydrocarbon,
TDS # CLF8
and halogenated solvents
Natural latex rubber
Deionized water
Nonflammable
190,000 cps
2 years
All types
15 min.
30 min.
7.2 lbs.
~ 80%
550°F
Pink

CLF8 Summary of contents

Page 1

... As with any solder masking agent, compatibility with substrate must be determined on a non- critical area prior to use. Test compatibility on bare copper. TDS # CLF8 Natural latex rubber Stable in all hydrocarbon, hydrofluorocarbon, chlorinated, and halogenated solvents All types ...

Page 2

... REMOVAL: After allowing the mask to become fully cured, peelable solder mask can be removed by hand or by the use of tweezers. Depending on ambient conditions, peelable mask may remain on assemblies for extended periods of time prior to component insertion. AVAILABILITY CLF8 8 oz. Squeeze Bottle CLF1 1 Gal. / 3.7 L liquid Yes Yes No Yes ...

Page 3

... ITW CHEMTRONICS SECTION 1: CHEMICAL PRODUCT AND COMPANY INFORMATION Product Information: 800-TECH-401 Product Identification Product Code: CLF8, CLF1 SECTION 2: COMPOSITION/INFORMATION ON INGREDIENTS Product Ingredient Information Polyisoprene emulsion (latex) Zinc dibutyl dithiocarbamate Acrylic polymer Methanol Titanium dioxide Trimethyl quinoline homopolymer Ammonium hydroxide SECTION 3: HAZARD IDENTIFICATION Emergency Overview: Opaque, pink, viscous liquid with mild ammonia odor ...

Page 4

... ITW CHEMTRONICS SECTION 9: PHYSICAL AND CHEMICAL PROPERTIES Physical State: Opaque, pink liquid Odor: Mild, ammonical Vapor Pressure: 760 100C Vapor Density: <1 (Air =1) Boiling Point: 212° F (100C) initial SECTION 10: STABILITY AND CHEMICAL PROPERTIES Stability - Stable. Conditions to Avoid: Storage above 120°F, exposure to light, loss of polymerization inhibitor, contamination with incompatible materials. ...