MAX3232ESE+ Maxim, MAX3232ESE+ Datasheet - Page 15

• Manufacturer Part Number: MAX3232ESE+
• Description: Transceiver; RS-232; +/- 25V; 0.4 V (Max.); 0.3 mA (Typ.) I/P; 235 Kbps (Typ.)
• Manufacturer: Maxim

Specifications of MAX3232ESE+

• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

Figure 6a shows the transmitter output voltages under
increasing load current at +3.0V. Figure 6b shows a
typical mouse connection using the MAX3241E.
The MAX3222E/MAX3232E/MAX3237E/MAX3241E/
MAX3246E maintain the RS-232 ±5V minimum transmit-
ter output voltage even at high data rates. Figure 7
shows a transmitter loopback test circuit. Figure 8
shows a loopback test result at 120kbps, and Figure 9
shows the same test at 250kbps. For Figure 8, all trans-
mitters were driven simultaneously at 120kbps into RS-
232 loads in parallel with 1000pF. For Figure 9, a single
transmitter was driven at 250kbps, and all transmitters
were loaded with an RS-232 receiver in parallel with
1000pF.
The MAX3237E maintains the RS-232 ±5.0V minimum
transmitter output voltage at data rates up to 1Mbps.
Figure 10 shows a loopback test result at 1Mbps with
MBAUD = V
loaded with an RS-232 receiver in parallel with 250pF.
The MAX3222E/MAX3232E/MAX3237E/MAX3241E/
MAX3246E can directly interface with various 5V logic
families, including ACT and HCT CMOS. See Table 3
for more information on possible combinations of inter-
connections.
Table 4. Reliability Test Data
±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V,
Temperature Cycle
Operating Life
Moisture Resistance
Low-Temperature Storage
Low-Temperature Operational
Solderability
ESD
High-Temperature Operating
Life
Interconnection with 3V and 5V Logic
TEST
CC
. For Figure 10, all transmitters were
______________________________________________________________________________________
Up to 1Mbps, True RS-232 Transceivers
T
T
T
T
T
T
8-hour steam age
±15kV, Human Body Model
T
A
A
A
A
A
A
J
= +150°C
High Data Rates
= -35°C to +85°C,
= -40°C to +100°C
= +70°C
= +20°C to +60°C, 90% RH
= -20°C
= -10°C
CONDITIONS
The UCSP represents a unique packaging form factor
that may not perform equally to a packaged product
through traditional mechanical reliability tests. UCSP
reliability is integrally linked to the user’s assembly
methods, circuit board material, and usage environ-
ment. The user should closely review these areas when
considering use of a UCSP package. Performance
through Operating Life Test and Moisture Resistance
remains uncompromised as the wafer-fabrication
process primarily determines it.
Mechanical stress performance is a greater considera-
tion for a UCSP package. UCSPs are attached through
direct solder contact to the user’s PC board, foregoing
the inherent stress relief of a packaged product lead
frame. Solder joint contact integrity must be consid-
ered. Table 4 shows the testing done to characterize
the UCSP reliability performance. In conclusion, the
UCSP is capable of performing reliably through envi-
ronmental stresses as indicated by the results in the
table. Additional usage data and recommendations are
detailed in the UCSP application note, which can be
found on Maxim’s website at www.maxim-ic.com.
DURATION
150 cycles,
900 cycles
240 hours
240 hours
240 hours
168 hours
24 hours
—
—
UCSP Reliability
FAILURES PER
SAMPLE SIZE
0/200
0/10,
0/10
0/10
0/10
0/10
0/15
0/45
0/5
15