HSP1 Crouzet USA, HSP1 Datasheet

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HSP1

Manufacturer Part Number
HSP1
Description
Accessory, Non-adhesive thermal pad for GN, GNA5, and Dual solid state relays
Manufacturer
Crouzet USA
Datasheet

Specifications of HSP1

Lead Free Status / Rohs Status
RoHS Compliant part

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For use with all single phase Panel mount SSR’s, Control modules and M50 power modules.
All Three phase (53TP) SSR’s.
HSP Series Thermal Pads
HSP1
HSP3
TYPICAL PROPERTIES
MECHANICAL SPECIFICATIONS
Description
Color
Thickness, inch (mm)
Adhesive One Side
Thermal Impeadance [°C-in²/W]
Apparent Thermal Conductivity [W/m-K]
Phase-Change Temperature [°C]
Operating Temperature Range [°C]
Volume Resistivity [ohm-cm]
Specific Gravity
Suggested Heatsink Clamping Pressure, psi (MPa)
(1)
Dispose of separator paper between pads prior to installation of SSR onto heatsink.
Installing separator paper with pad may result in relay failure.
• Easy-to-use thermal interface Material designed for use with
• Excellent alternative to thermal grease
• Shipped in packs of 25
Standard Crydom single-phase and three-phase
solid-state relays.
20 to 100 (0.138 to 0.690)
HSP1/HSP3
0.003 (0.076)
0.03 @20 psi
-55 to 150
10
White
12
No
1.0
NA
60
Ohm
Rev. 072409

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HSP1 Summary of contents

Page 1

... Suggested Heatsink Clamping Pressure, psi (MPa) MECHANICAL SPECIFICATIONS (1) Dispose of separator paper between pads prior to installation of SSR onto heatsink. Installing separator paper with pad may result in relay failure. Standard Crydom single-phase and three-phase solid-state relays. HSP1/HSP3 White 0.003 (0.076) No 0.03 @20 psi 1.0 60 ...

Page 2

ANNEX - ENVIROMENTAL INFORMATION ...

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