MC33989DW Freescale Semiconductor, MC33989DW Datasheet - Page 62

• Manufacturer Part Number: MC33989DW
• Description: IC SYSTEM BASE W/CAN 28-SOIC
• Manufacturer: Freescale Semiconductor

Specifications of MC33989DW

• Controller Type: System Basis Chip
• Interface: CAN
• Voltage - Supply: 5.5 V ~ 18 V
• Current - Supply: 45mA
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 28-SOIC (7.5mm Width)
• For Use With: KIT33989DWEVB - KIT EVAL 33989DW HS SBC
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
INTRODUCTION
datasheet. The addendum provides thermal performance information that may be
critical in the design and development of system applications. All electrical,
application, and packaging information is provided in the data sheet.
Packaging and Thermal Considerations
single heat source (P), a single junction temperature (T
(R
package to another in a standardized environment. This methodology is not
meant to and will not predict the performance of a package in an application-
specific environment. Stated values were obtained by measurement and
simulation according to the standards listed below.
Standards
Table 36. Thermal Performance Comparison
62
33989
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
Notes
R
R
R
R
θJA
This thermal addendum is provided as a supplement to the MC33989 technical
The MC33989 is offered in a 28 pin SOICW, single die package. There is a
The stated values are solely for a thermal performance comparison of one
θJA
θJB
θJA
θJC
1.
2.
3.
4.
5.
).
Thermal Resistance
(1) (2)
(2) (3)
(1) (4)
(5)
Per JEDEC JESD51-2 at natural convection, still air
condition.
2s2p thermal test board per JEDEC JESD51-7.
Per JEDEC JESD51-8, with the board temperature on the
center trace near the center lead.
Single layer thermal test board per JEDEC JESD51-3.
Thermal resistance between the die junction and the
package top surface; cold plate attached to the package top
surface and remaining surfaces insulated.
T
J
=
R
θJA
.
P
[°C/W]
220
41
10
68
J
), and thermal resistance
Figure 62. Surface Mount for SOIC Wide Body
Note For package dimensions, refer to
the 33989 device datasheet.
18.0 mm x 7.5 mm Body
28 Terminal SOICW
non-Exposed Pad
Analog Integrated Circuit Device Data
1.27 mm Pitch
EG SUFFIX (PB-FREE)
33989DWB
33989EG
28-PIN SOICW
98ASB42345B
DWB SUFFIX
SOICW
28-PIN
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