ENC28J60-I/SO Microchip Technology, ENC28J60-I/SO Datasheet - Page 86

• Manufacturer Part Number: ENC28J60-I/SO
• Description: IC ETHERNET CTRLR W/SPI 28SOIC
• Manufacturer: Microchip Technology

Specifications of ENC28J60-I/SO

• Package / Case: 28-SOIC (7.5mm Width)
• Controller Type: Ethernet Controller, MAC/10Base-T
• Interface: SPI
• Voltage - Supply: 3.1 V ~ 3.6 V
• Current - Supply: 160mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Input Voltage Range (max): 5.5 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Operating Supply Voltage: 3.1 V to 3.6 V
• Supply Current (max): 180 mA
• Data Rate: 10Mbps
• No. Of Ports: 1
• Ethernet Type: IEEE 802.3
• Interface Type: SPI
• Supply Current: 180mA
• Supply Voltage Range: 3.1V To 3.6V
• Operating Temperature Range: -40°C To +85°C
• Rohs Compliant: Yes
• Peak Reflow Compatible (260 C): No
• Leaded Process Compatible: No
• Product: Ethernet Controllers
• Standard Supported: IEEE 802.3
• Ethernet Connection Type: 10Base-T
• Digital Ic Case Style: SOIC
• No. Of Pins: 28
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DM163024 - BOARD DEMO PICDEM.NET 2AC164123 - BOARD DAUGHTER ETH PICTAIL PLUSAC164121 - BOARD DAUGHTER PICTAIL ETHERNET
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

ENC28J60
17.2
The following sections give the technical details of the packages.
28-Lead Skinny Plastic Dual In-line (SP) – 300 mil Body (PDIP)
DS39662B-page 84
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MO-095
Drawing No. C04-070
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
Package Details
n
eB
E1
E
2
1
Dimension Limits
c
D
§
A1
A
Units
A2
E1
B1
eB
A1
D
A
E
B
n
p
L
c
MIN
1.345
.125
.015
.275
.125
Preliminary
.140
.300
.008
.040
.016
.320
5
5
B
B1
INCHES*
NOM
28
1.365
.100
.150
.130
.310
.285
.130
.012
.053
.019
.350
10
10
MAX
1.385
.160
.135
.325
.295
.135
.015
.065
.022
.430
15
15
MIN
34.16
3.56
3.18
0.38
7.62
6.99
3.18
0.20
1.02
8.13
0.41
5
5
© 2006 Microchip Technology Inc.
MILLIMETERS
p
NOM
28
34.67
2.54
3.30
7.87
7.24
3.30
0.29
1.33
0.48
8.89
3.81
10
10
A2
L
MAX
35.18
10.92
1.65
4.06
3.43
8.26
7.49
3.43
0.38
0.56
15
15