ATH030A0X3-SRHZ Lineage Power, ATH030A0X3-SRHZ Datasheet - Page 19

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ATH030A0X3-SRHZ

Manufacturer Part Number
ATH030A0X3-SRHZ
Description
DC/DC Converters & Regulators 0.8-3.63Vout 30A SMT 4.5-5.5Vin W/2ground
Manufacturer
Lineage Power
Series
ATH030r
Type
Step Downr
Datasheets

Specifications of ATH030A0X3-SRHZ

Product
Non-Isolated / POL
Output Power
109 W
Input Voltage Range
4.5 V to 5.5 V
Number Of Outputs
1
Output Voltage (channel 1)
0.8 V to 3.63 V
Output Current (channel 1)
30 A
Package / Case Size
SMD
Output Type
Non-Isolated
Output Voltage
0.8 V to 3.63 V
Package / Case
SMD
Output Current
30A
Input Voltage
5V
Screening Level
Industrial
Product Length (mm)
33mm
Product Height (mm)
7.53mm
Product Depth (mm)
13.5mm
Mounting Style
Surface Mount
Pin Count
10
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
CC109109567
Wind Tunnel
Data Sheet
April 9, 2010
Thermal Considerations
Power modules operate in a variety of thermal
environments; however, sufficient cooling should
always be provided to help ensure reliable
operation.
Considerations include ambient temperature,
airflow, module power dissipation, and the need for
increased reliability. A reduction in the operating
temperature of the module will result in an increase
in reliability. The thermal data presented here is
based on physical measurements taken in a wind
tunnel. The test set-up is shown in Figure 54. Note
that the airflow is parallel to the short axis of the
module as shown in Figure 55. The derating data
applies to airflow in either direction of the module’s
long axis.
Figure 54. Thermal Test Setup.
LINEAGE
PWBs
POWER
flow
Air
(0.50)
x
12.7_
(3.0)
76.2_
25.4_
(1.0)
Austin MegaLynx
Probe Location
for measuring
airflow and
ambient
temperature
Power Module
4.5 – 5.5Vdc input; 0.8 to 3.63Vdc Output; 30A output current
6.0 – 14Vdc Input; 0.8Vdc to 3.63Vdc Output; 20/30A output
TM
The thermal reference points, T
specifications are shown in Figure 56. For reliable
operation the temperatures at these points should
not exceed 125
should not exceed the rated power of the module
(Vo,set x Io,max).
Please refer to the Application Note “Thermal
Characterization Process For Open-Frame Board-
Mounted Power Modules” for a detailed discussion
of thermal aspects including maximum device
temperatures.
Figure 56. T ref Temperature measurement
location.
SMT: Non-Isolated DC-DC Power Modules:
Figure 55. Airflow direction for thermal testing.
o
C. The output power of the module
ref
used in the
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