XPC850DSLVR50BU Freescale Semiconductor, XPC850DSLVR50BU Datasheet - Page 66

• Manufacturer Part Number: XPC850DSLVR50BU
• Description: IC MPU POWERQUICC 50MHZ 256-PBGA
• Manufacturer: Freescale Semiconductor

Specifications of XPC850DSLVR50BU

• Processor Type: MPC8xx PowerQUICC 32-Bit
• Speed: 50MHz
• Voltage: 3.3V
• Mounting Type: Surface Mount
• Package / Case: 256-PBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -

Mechanical Data and Ordering Information
Figure 64
66
C
A1
Figure 64. Package Dimensions for the Plastic Ball Grid Array (PBGA)—non-JEDEC Standard
A
SIDE VIEW
MPC850 PowerQUICC™ Integrated Communications Processor Hardware Specifications, Rev. 2
shows the non-JEDEC package dimensions of the PBGA.
256X
SEATING
PLANE
A2
A3
0.35 C
0.20 C
4X
(E1)
0.20
4X
15X
E
e /2
B
A
e
E2
BOTTOM VIEW
1
2
3
4
5
6
TOP VIEW
7 8 9 10 11 12 13 14 15
(D1)
D2
15X
D
256X
e
0.30
0.15
b
M
M
16
C A B
C
R
N
M
K
H
G
D
C
B
A
T
P
L
J
F
E
NOTES:
1.
2.
3.
4.
DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
DIMENSIONS IN MILLIMETERS.
DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER, PARALLEL TO PRIMARY
DATUM C.
PRIMARY DATUM C AND THE SEATING PLANE ARE
DIM
A1
A2
A3
D1
D2
E1
E2
A
b
D
E
e
19.00
19.00
MILLIMETERS
MIN
1.91
0.50
1.12
0.29
0.60
23.00 BSC
19.05 REF
23.00 BSC
19.05 REF
1.27 BSC
20.00
20.00
Freescale Semiconductor
MAX
2.35
0.70
1.22
0.43
0.90