QU80386EXTC33 Intel, QU80386EXTC33 Datasheet - Page 24

• Manufacturer Part Number: QU80386EXTC33
• Description: IC INT PROC 5V 33MHZ 132QFP
• Manufacturer: Intel

Specifications of QU80386EXTC33

• Processor Type: 386EX
• Features: 32-bit, Extended Temp
• Speed: 33MHz
• Voltage: 5V
• Mounting Type: Surface Mount
• Package / Case: 132-QFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 863827

Intel386™ EX Embedded Microprocessor
5.2
5.3
24
Table 6.
Component and Revision Identifiers
To assist users, the microprocessor holds a component identifier and revision identifier in its DX
register after reset. The upper 8 bits of DX hold the component identifier, 23H. (The lower nibble,
3H, identifies the Intel386 architecture, while the upper nibble, 2H, identifies the second member
of the Intel386 microprocessor family.)
The lower 8 bits of DX hold the revision level identifier. The revision identifier will, in general,
chronologically track those component steppings that are intended to have certain improvements or
distinction from previous steppings. The revision identifier will track that of the Intel386 CPU
whenever possible. However, the revision identifier value is not guaranteed to change with every
stepping revision or to follow a completely uniform numerical sequence, depending on the type or
intent of the revision or the manufacturing materials required to be changed. Intel has sole
discretion over these characteristics of the component. The initial revision identifier for the
Intel386 EX microprocessor is 09H.
Package Thermal Specifications
The Intel386 EX microprocessor is specified for operation with a minimum case temperature
(T
dissipation (see Figures 4 through 7). The case temperature can be measured in any environment to
determine whether the microprocessor is within the specified operating range. The case
temperature should be measured at the center of the top surface opposite the pins.
An increase in the ambient temperature (T
(T
packaged device produces thermal resistance between junction and case temperatures (
between junction and ambient temperatures (
thermal resistance parameters are expressed by these equations:
T
T
T
P = power dissipated as heat = V
A safe operating temperature can be calculated from the above equations by using the maximum
safe T
6. The
ventilation, board layout, board thickness, and potentially other factors in the design of the
application. The
Thermal Resistances (0°C/W)
Figures 4 through 7 provide maximum case temperature as a function of frequency.
A
CASE
J
CASE(MIN)
CASE
= T
= T
132 PQFP
144 TQFP
= T
CASE
J
Package
J
of 120° C, the power drawn by the chip in the specific design, and the
) and the junction temperature (T
– P
JA
A
+ P
value depends on the airflow (measured at the top of the chip) provided by the system
+ P
) of -40° C and a maximum case temperature (T
JA
[
JC
JA
JA
values are given for reference only and are not guaranteed.
–
7
4
JC
JC
]
28
36
CC
0
JA
JA
I
CC
vs. Airflow (ft/min)
,
J
), which is the junction temperature on the die itself. A
JC
A
) causes a proportional increase in the case temperature
100
24
31
JA
). The relationships between the temperature and
200
22
27
CASE(MAX)
) dependent on power
JC
value from Table
Datasheet
JC
) and