FWIXP420BB Intel, FWIXP420BB Datasheet - Page 78
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FWIXP420BB
Manufacturer Part Number
FWIXP420BB
Description
IC NETWRK PROCESSR 266MHZ 492BGA
Manufacturer
Intel
Specifications of FWIXP420BB
Processor Type
Network
Features
XScale Core
Speed
266MHz
Voltage
1.3V
Mounting Type
Surface Mount
Package / Case
492-BGA
Core Operating Frequency
266MHz
Package Type
BGA
Pin Count
492
Mounting
Surface Mount
Operating Temperature (max)
70C
Operating Temperature (min)
0C
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
852278
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
FWIXP420BB
Manufacturer:
MICRON
Quantity:
2 198
Part Number:
FWIXP420BB
Manufacturer:
INTEL
Quantity:
20 000
Table 25.
4.3
Intel
Datasheet
78
®
IXP42X Product Line of Network Processors and IXC1100 Control Plane Processor
Note:
AE10
AE11
AE12
AE13
AE14
AE15
AE16
AE17
AE18
AE19
AE20
AE21
AE22
AE23
AE24
AE25
AE26
Ball
AE1
AE2
AE3
AE4
AE5
AE6
AE7
AE8
AE9
and Intel
Ball Map Assignment for the Intel
Package Thermal Specifications
The thermal characterization parameter “Ψ
difference between the top, center of the package and the junction temperature.
This can be a useful value for verifying device temperatures in an actual environment.
By measuring the package of the device, the junction temperature can be estimated, if
the thermal characterization parameter has been measured under similar conditions.
The use of Ψ
the device junction to the external surface of the package or case nearest the die
attachment — as the case is held at a constant temperature.
The case temperature can then be monitored to make sure that the maximum junction
temperature is not violated. Examples are given in the following sections.
Case temperature = Junction Temperature - (
Dissipation)
T
JC
ETH_RXDATA0[3]
Interfaces not being utilized at a system level require external pull-up or pull-down resistors. For specific details and
requirements, see
= T
ETH_RXDV1
ETH_TXEN1
ETH_COL0
ETH_COL1
HIGHZ_N
VCCPLL1
VCCPLL2
JTG_TDI
Signal
VCCP
VCCP
VCCP
VCCP
VCCP
VCCP
VCCP
VCCP
J
VSS
VSS
VSS
VSS
N/C
N/C
N/C
N/C
N/C
- (
®
Ψ
IXC1100 Control Plane Processor (Sheet 7 of 7)
JT
JT
should not be confused with Θ
Section 3.0, “Functional Signal Descriptions” on page
* Power Dissipation)
AF10
AF11
AF12
AF13
AF14
AF15
AF16
AF17
AF18
AF19
AF20
AF21
AF22
AF23
AF24
AF25
AF26
Ball
AF1
AF2
AF3
AF4
AF5
AF6
AF7
AF8
AF9
ETH_RXDATA0[2]
ETH_TXDATA1[3]
ETH_RXDATA1[0]
ETH_TXCLK1
BYPASS_CLK
(Reserved)
ETH_MDIO
ETH_CRS1
OSC_OUT
VSSOSCP
JTG_TMS
JTG_TCK
VSSOSC
VCCOSC
OSC_IN
Signal
Intel
N/C
N/C
N/C
N/C
N/C
N/C
N/C
N/C
N/C
N/C
N/C
®
IXP42X product line and IXC1100 control plane processors
®
IXP420 Network Processor
Ball
JT”
jc,
is proportional to the temperature
Ψ
which is the thermal resistance from
JT
* Power
Signal
32.
Document Number: 252479-006US
Ball
Signal
August 2006