MPC852TVR50 Freescale Semiconductor, MPC852TVR50 Datasheet - Page 10

• Manufacturer Part Number: MPC852TVR50
• Description: IC MPU POWERQUICC 50MHZ 256-PBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC852TVR50

• Processor Type: MPC8xx PowerQUICC 32-Bit
• Speed: 50MHz
• Voltage: 1.8V
• Mounting Type: Surface Mount
• Package / Case: 256-PBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -

References
7.5 Experimental Determination
To determine the junction temperature of the device in the application after prototypes are available, the thermal
characterization parameter (Ψ
temperature at the top center of the package case using the following equation:
T
where:
The thermal characterization parameter is measured per JESD51-2 specification published by JEDEC using a
40-gauge type T thermocouple epoxied to the top center of the package case. The thermocouple should be positioned
so that the thermocouple junction rests on the package. A small amount of epoxy is placed over the thermocouple
junction and over about 1 mm of wire extending from the junction. The thermocouple wire is placed flat against the
package case to avoid measurement errors that cooling effects of the thermocouple wire cause.
8 References
Semiconductor Equipment and Materials International(415) 964-5111
805 East Middlefield Rd
Mountain View, CA 94043
MIL-SPEC and EIA/JESD (JEDEC) specifications800-854-7179 or
(Available from Global Engineering documents)303-397-7956
JEDEC Specifications http://www.jedec.org
1. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an Automotive Engine
Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47-54.
2. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance and Its
Application in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999, pp. 212-220.
9 Power Supply and Power Sequencing
This section provides design considerations for the MPC852T power supply. The MPC852T has a core voltage
(V
the MPC852T is supplied with 3.3 V across V
The signal PA[0:3], PA[8:11], PB15, PB[24:25]; PB[28:31], PC[4:7], PC[12:13], PC15] PD[3:15], TDI, TDO, TCK,
TRST, TMS, MII_TXEN, MII_MDIO are 5 V-tolerant. All inputs cannot be more than 2.5 V greater than V
addition, 5 V-tolerant pins can not exceed 5.5 V, and remaining input pins cannot exceed 3.465 V. This restriction
applies to power-on reset or power down and normal operation.
10
J
DDL
= T
T
) and PLL voltage (V
Ψ
T
P
+(Ψ
D
T
JT
= thermocouple temperature on top of package
= power dissipation in package
JT
= thermal characterization parameter
x P
D
)
DDSYN
JT
) can be used to determine the junction temperature with a measurement of the
) that operates at a lower voltage than the I/O voltage V
MPC852T Hardware Specifications, Rev. 3.1
DDH
and V
SS
(GND).
DDH
Freescale Semiconductor
. The I/O section of
DDH
. In