MC68882FN25A Freescale Semiconductor, MC68882FN25A Datasheet - Page 16

• Manufacturer Part Number: MC68882FN25A
• Description: IC MATH COPROCESSOR 68-PLCC
• Manufacturer: Freescale Semiconductor

Specifications of MC68882FN25A

• Processor Type: Floating-Point Co-Processor
• Speed: 25MHz
• Mounting Type: Surface Mount
• Package / Case: 68-PLCC
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Voltage: -

$ ~ji~t
where K is a constant
can be determined
the values of PD and T&#~~~~&’obtained
tions (1) and (2) ite$at~~l&%or
THERMAL
where:
For most applications
PD and TJ (if Pi/0 is neglected):
(at equilibrium)
—
*Capacitance is periodically sampled rather than 10070tested.
MAXIMUM
POWER
be obtained
DC ELECTRl&#&j&ARACTERISTICS
~Hi-Z (Off State) ,Input Current ~1.2.4 V/O.4V
Thermal
?k~:~’:~dw \,oltage
Output High Voltage (IOH = -400 wA)
Output Low Voltage (iOL = 5,3 mA)
Output Low Current (VOL= GND)
Power Dissipation
Capacitance* (Vin =0, TA=250C, f= 1 MHz)
Output Load Capacitance
Supply Voltage
Input Voltage
Operating Temperature
Storage Temperature
lnpu#Wg~+oltage
,,
The following
Solving
The average
TA
8JA
pD
PINT = ICC x VCC, Watts — Chip Internal
Pi/0
Junction to Ambient
Junction to Case
. . . . ... ...-.,.:..... . ... .......... . ...
~~
Leakage Current @t5.25 V
,,.,.... . . .
CONSIDERATIONS
*:4>* .g ~,.,
= PINT+ Pi/0
= Power Dissipation
= Ambient
= Package Thermal
Resistance — Ceramic
equations
..,t .,,.1,
CHARACTERISTICS
>
..l\,...*+
RATINGS
K= PD (TA+ 273°C) t8j~$PD2
from:
Junction-to-Ambient,
Pins — User Determined
Characteristic
.
chip-junction
y. ,, \‘:?*.,,{>
for a kno~n
. J:{.;,!,
is an approximate
,;~~~ d:”
Rating
PD = K+ (TJ + 273”C] ~~’$!?j’~>
:,<
TJ=TA+(PD06JA)
.\~.}\\.\.
from e~M&~A&~(3) by measurin9
Temperature,
(1) and (2) for.@~~#l@
\
pertainiq~~~~~
P1/O<PINT and can be ~~$~q~ed.
Resistance,
temperature,
~~. Using this value of K,
Freescale Semiconductor, Inc.
on Input and Output
any value of TA.
For More Information On This Product,
Characteristic
‘C
OC/W
.
relation~~f~%ween
(Vcc =5.o Vdct5%;
CLK, RESET, R/~, AO-A4, CS, DS, AS, SIZE
.
particular
by solving equa-
Symbol
Symbol
Vcc
T~tq
9JA
Go to: www.freescale.com
8JC
~n
ELECTRICAL SPECIFICATIONS
TA
TJ, in ‘C can
,,:.+; .
Power
?,:,.:
\
. . . . .
. .. .... . . .
,,1 >:. .’:’
part. K
–0.3
–0.3
–55to
~,
~,
~,
o to
pD
(2)
(3)
Value
Value
(1)
.:k.
33
15
to
to
+ .+,?!
GND = O Vdc; TA= O°Cto 700C)
%,+$~tlmized by such thermal
70
+150
~$t,:.,..
J #“’S$JC
3,J$&&r.
‘
+7.0
+7.0
,.,,.
~,
dependent
for thermal
m,
m,
separated
senting
junctio,$.t$,th~
case tq $he+Dutside ambient
lat@ b~she equation:
...
sinks, ambient
good thermal
Significantly
eJc.
in a lower semiconductor
ment, unless estimated,
dure
“Thermal
Microcomponent
purposes
——
.ti.,.$,m
..
Values for thermal
The total thermdk,g@Wstance of a package
Rating
~ s~, ,
“cm
~
Unit
Substitution
.,.
‘c
‘c
However,
v
v
described
is device related and cannot be influenced
-.’,
——
th@.*Q~#$i~eFto heat flow from the semiconductor
DO-D31
DO-D31
DO-D31
SENSE
only, Thermal
Resistance
.
in,t$’{~&o
on procedure
resistance
reduce 6CA so that
.
management
air cooling,
package (case) surface
6CA is user dependent
in Motorola
of
<,*,:b’+~
Symbol
Devices,”
vOH
vOL
vlH
ITSI
vlL
IOL
Cin
pD
CL
eJc
Iin
:.?.
eJA=
components,
Measurement
resistance
may differ.
management
for
measurements
were derived
and setup, User derived values
junction
6JC+
and-thermal
GND –0,5
eJA
and are provided
on the p,art of the user can
(OCA). These terms are re-
Min
2.0
2.4
—
—
—
—
—
—
—
Reliability
eJA approximately
in equation
6CA
presented
OJC and eCA, repre-
temperature.
Method
techniques
(eJc)
convention.
using the proce-
are complex
and can be min-
Max
Vcc
0.75
500
130
0.8
0.5
20
20
—
10
Report
and from the
(1) will result
in this docu-
(0.jA)
for MC68XX
-.
for design
as heat
can be
equals
by the
Unit
7843,
Thus,
WA
FA
PA
w
pF
pF
v
v
v
v
and
(4)