A80960HA40SL2GZ Intel, A80960HA40SL2GZ Datasheet - Page 34
A80960HA40SL2GZ
Manufacturer Part Number
A80960HA40SL2GZ
Description
IC MPU I960HA 3V 40MHZ 168-PGA
Manufacturer
Intel
Datasheet
1.UG80960HD6616SL2GN.pdf
(104 pages)
Specifications of A80960HA40SL2GZ
Rohs Status
RoHS non-compliant
Processor Type
i960
Features
HA suffix, 32-Bit, 16K Cache
Speed
40MHz
Voltage
3.3V
Mounting Type
Surface Mount
Package / Case
168-PGA
Other names
813628
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80960HA/HD/HT
3.4
3.5
3.6
34
Figure 6. 80960Hx Device Identification Register
Heat Sink Adhesives
Intel recommends silicone-based adhesives to attach heat sinks to the PGA package. There is no
particular recommendation concerning the PQ4 package.
PowerQuad4 Plastic Package
The 80960Hx family is available in an improved version of the common 208-lead SQFP plastic
package called the PowerQuad4* (PQ4). The PQ4 package dimensions and lead pitch are identical
to the SQFP package and the former PQ2 package, so the PQ4 fits into the same board footprint.
The advantage of the PQ4 package is the superior thermal conductivity that allows the plastic
version of the 80960Hx to operate with the same 0 °C to 85 °C temperature specifications as the
more expensive ceramic PGA package.
The PQ4 package integrates a copper heat sink within the package to dissipate heat effectively. See
Table 14
Stepping Register Information
The memory-mapped register at FF008710H contains the 80960Hx Device ID. The ID is identical
to the ID obtained from a JTAG Query.
value for device identification is compliant with the IEEE 1149.1 specification and Intel standards.
Table 16
and
describes the fields of the device ID.
Table 15
Version
28
V
for more information.
CC
1
0
0
Product
Type
24
0
1
0
Part Number
0
20
0
Figure 6
0
Gen
1
0
16
defines the current 80960Hx Device IDs. The
Model
12
0
0
0
Manufacturer ID
0
8
0
0
0
1
4
0
0
1
1
0
1
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