N80960SB16 Intel, N80960SB16 Datasheet - Page 30

• Manufacturer Part Number: N80960SB16
• Description: IC MPU I960SB 16MHZ 84-PLCC
• Manufacturer: Intel

Specifications of N80960SB16

• Rohs Status: RoHS non-compliant
• Processor Type: i960
• Features: SB suffix, 32-Bit, 512 Byte Cache
• Speed: 16MHz
• Voltage: 5V
• Mounting Type: Surface Mount
• Package / Case: 84-PLCC
• Other names: 803883

80960SB
3.4
The 80960SB is specified for operation when case
temperature is within the range 0°C to +85°C (PLCC)
or 0°C to 100°C (QFP). Measure case temperature
at the top center of the package. Ambient temper-
ature can be calculated from:
T
T
T
26
A
J
C
= T
= T
= T
C
J
A
- P*
Package Thermal Specifications
+ P*
+ P*
measured in the middle of the
top of the package)
(No Heatsink)
NOTES:
This table applies to 80960SB QFP soldered directly to board.
(No Heatsink)
NOTES:
This table applies to 80960SB PLCC soldered directly to board.
JA
Junction-to-Ambient (Case
Junction-to-Case
Junction-to-Ambient
Junction-to-Case
JC
JA
Parameter
JC
Parameter
]
Table 14. 80960SB PLCC Package Thermal Characteristics
Table 13. 80960SB QFP Package Thermal Characteristics
33
11
0
Thermal Resistance — °C/Watt
Thermal Resistance — °C/Watt
54
11
0
50
31
11
50
52
11
28.5
100
11
Airflow — ft./min (m/sec)
Airflow — ft./min (m/sec)
Compute P by multiplying the maximum voltage by
the typical current at maximum temperature. Values
for
13 for the QFP package and in Table 14 for the
PLCC package. I
typically 80 percent of specified I
100
49
11
200
27
11
JA
and
200
45
11
400
24
11
JC
for various airflows are given in Table
CC
400
600
39
11
22
11
at maximum temperature is
600
800
35
11
20
11
CC
maximum (cold).
1000
19.5
800
33
11
11