MC8640TVU1250HE Freescale Semiconductor, MC8640TVU1250HE Datasheet - Page 87
MC8640TVU1250HE
Manufacturer Part Number
MC8640TVU1250HE
Description
IC MPU SGL CORE E600 1023FCCBGA
Manufacturer
Freescale Semiconductor
Datasheet
1.MC8640HX1067NE.pdf
(130 pages)
Specifications of MC8640TVU1250HE
Processor Type
MPC86xx PowerPC 32-Bit
Speed
1.25GHz
Voltage
1.05V
Mounting Type
Surface Mount
Package / Case
994-FCCBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
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Part Number:
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Random jitter is calibrated using a high pass filter with a low frequency corner at 20 MHz and a 20
dB/decade roll-off below this. The required sinusoidal jitter specified in
Specifications,”
16 Package
This section details package parameters and dimensions.
16.1
The package parameters are as provided in the following list. The package type is 33 mm × 33 mm, 1023
pins. There are two package options: high-lead flip chip-ceramic ball grid array (FC-CBGA) and lead-free
(FC-CBGA).
Freescale Semiconductor
For all package types:
Die size
Package outline
Interconnects
Pitch
Total Capacitor count
For high-lead FC-CBGA (package option: HCTE
Maximum module height
Minimum module height
Solder Balls
Ball diameter (typical
For RoHS lead-free FC-CBGA (package option: HCTE
Maximum module height
Minimum module height
Solder Balls
Ball diameter (typical
1
2
High-coefficient of thermal expansion
Typical ball diameter is before reflow
Package Parameters for the MPC8640
MPC8640 and MPC8640D Integrated Host Processor Hardware Specifications, Rev. 3
is then added to the signal and the test load is replaced by the receiver being tested.
2
2
)
)
1 mm
43 caps; 100 nF each
2.97 mm
2.47 mm
89.5% Pb 10.5% Sn
0.60 mm
2.77 mm
2.27 mm
95.5% Sn 4.0% Ag 0.5% Cu
0.60 mm
12.1 mm × 14.7 mm
33 mm × 33 mm
1023
1
HX)
1
VU)
Section 15.7, “Receiver
Package
87
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