XPC8260CVVIFBC Freescale Semiconductor, XPC8260CVVIFBC Datasheet - Page 6

• Manufacturer Part Number: XPC8260CVVIFBC
• Description: IC MPU POWERQUICC II 480-TBGA
• Manufacturer: Freescale Semiconductor

Specifications of XPC8260CVVIFBC

• Processor Type: MPC82xx PowerQUICC II 32-bit
• Speed: 200MHz
• Voltage: 2.5V
• Mounting Type: Surface Mount
• Package / Case: 480-TBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -

Electrical and Thermal Characteristics
Table 2
This device contains circuitry protecting against damage due to high static voltage or electrical fields;
however, it is advised that normal precautions be taken to avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage level (either GND or V
Figure 2
MPC8280. Note that in PCI mode the I/O interface is different.
6
1
2
Core supply voltage
PLL supply voltage
I/O supply voltage
Input voltage
Junction temperature (maximum)
Caution: These are the recommended and tested operating conditions. Proper device operating outside of these
conditions is not guaranteed.
Parts labeled with an “-HVA” suffix are 2.6-V devices.
lists recommended operational voltage conditions.
shows the undershoot and overshoot voltage of the 60x and local bus memory interface of the
MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2
VDDH, VCCSYN, and VDD must track each other and both must vary in
the same direction—in the positive direction (+5% and +0.1 Vdc) or in the
negative direction (–5% and –0.1 Vdc).
Rating
V
V
IH
IL
GND – 0.3 V
GND – 1.0 V
GV
Table 2. Recommended Operating Conditions
DD
NOTE: Core, PLL, and I/O Supply Voltages
GV
+ 5%
GND
Figure 2. Overshoot/Undershoot Voltage
4 V
DD
VCCSYN
Symbol
VDDH
VDD
VIN
T
j
Not to exceed 10%
of t
SDRAM_CLK
GND (-0.3) – 3.465
2.5-V Device
3.135 – 3.465
2.4–2.7
2.4–2.7
CC
105
).
1
2
Freescale Semiconductor
Unit
°C
V
V
V
V