XPC8260ZUHFBC Freescale Semiconductor, XPC8260ZUHFBC Datasheet - Page 25

• Manufacturer Part Number: XPC8260ZUHFBC
• Description: IC MPU POWERQUICC II 480-TBGA
• Manufacturer: Freescale Semiconductor

Specifications of XPC8260ZUHFBC

• Processor Type: MPC82xx PowerQUICC II 32-bit
• Speed: 166MHz
• Voltage: 2.5V
• Mounting Type: Surface Mount
• Package / Case: 480-TBGA
• Family Name: MPC82XX
• Device Core: PowerQUICC II
• Device Core Size: 32b
• Frequency (max): 166MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.8V
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Operating Temp Range: 0C to 105C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 480
• Package Type: TBGA
• Rohs Compliant: NO
• Peak Reflow Compatible (260 C): No
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Lead Free Status / Rohs Status: Not Compliant

Figure 14
Table 14
Table
Freescale Semiconductor
BR
BG
ABB/IRQ2
TS
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
14.
shows the pinout list of the MPC8260.
MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2
shows the side profile of the TBGA package to indicate the direction of the top surface view.
Soldermask
1.27 mm Pitch
Polymide Tape
(Oxidized for Insulation)
Copper Heat Spreader
Figure 14. Side View of the TBGA Package
Pin Name
Glob-Top Dam
Table 14. Pinout List
Table 15
Glob-Top Filled Area
View
Die
defines conventions and acronyms used in
Wire Bonds
Attach
Die
Copper Traces
Cavity
Etched
W5
F4
E2
E3
G1
H5
H2
H1
J5
J4
J3
J2
J1
K4
K3
K2
K1
L5
L4
L3
L2
L1
Pressure Sensitive
Adhesive
Ball
Pinout
25