MPC8555ECPXAJD Freescale Semiconductor, MPC8555ECPXAJD Datasheet - Page 74

• Manufacturer Part Number: MPC8555ECPXAJD
• Description: IC MPU POWERQUICC III 783-FCPBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC8555ECPXAJD

• Processor Type: MPC85xx PowerQUICC III 32-Bit
• Speed: 533MHz
• Voltage: 1.2V
• Mounting Type: Surface Mount
• Package / Case: 783-FCPBGA
• For Use With: MPC8555CDS - BOARD EVALUATION CDS FOR 8555CWH-PPC-8555N-VX - BOARD EVAL QUICCSTART MPC8555CWH-PPC-8540N-VE - KIT EVAL SYSTEM MPC8540CWH-PPC-8555N-VE - EVALUATION SYSTEM QUICC MPC8555E
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -

Thermal
16.2.4
The following section provides a heat sink selection example using one of the commercially available heat
sinks.
16.2.4.1
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
where
During operation the die-junction temperatures (T
Table
and the air temperature rise within the electronic cabinet. An electronic cabinet inlet-air temperature (T
may range from 30° to 40°C. The air temperature rise within a cabinet (T
10°C. The thermal resistance of some thermal interface material (θ
purposes of this example, the θ
documented in note 4 is used. If a thermal pad is used, θ
Assuming a T
8.0 W, the following expression for T
The heat sink-to-ambient thermal resistance (θ
#2328B is shown in
Assuming an air velocity of 2 m/s, we have an effective θ
resulting in a die-junction temperature of approximately 69°C which is well within the maximum
operating temperature of the component.
74
2. The temperature of air cooling the component greatly depends on the ambient inlet air temperature
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4707 Detroit Ave.
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T
T
T
θ
θ
θ
P
MPC8555E PowerQUICC™ III Integrated Communications Processor Hardware Specification, Rev. 4.2
JC
INT
SA
D
J
I
R
is the die-junction temperature
is the inlet cabinet ambient temperature
is the power dissipated by the device. See
is the air temperature rise within the computer cabinet
Die-junction temperature: T
is the junction-to-case thermal resistance
is the heat sink base-to-ambient thermal resistance
Heat Sink Selection Examples
is the adhesive or interface material thermal resistance
Case 1
I
T
T
of 30°C, a T
J
J
= T
= 30°C + 5°C + (0.96°C/W + 3.3°C/W) × 8.0 W,
Figure
I
+ T
R
+ (θ
R
47.
of 5°C, a FC-PBGA package θ
JC
JC
value given in
+ θ
J
INT
is obtained:
J
= 30°C + 5°C + (0.96°C/W + θ
+ θ
SA
SA
) × P
Table 49
) versus airflow velocity for a Thermalloy heat sink
J
) should be maintained within the range specified in
D
Table 4
INT
that includes the thermal grease interface and is
SA+
888-246-9050
must be added.
JC
and
of about 3.3°C/W, thus
= 0.96, and a power consumption (P
Table
INT
) may be about 1°C/W. For the
5.
SA
R
) may be in the range of 5° to
) × 8.0 W
Freescale Semiconductor
D
) of
A
)