LE80538VE0041M Intel, LE80538VE0041M Datasheet - Page 3

• Manufacturer Part Number: LE80538VE0041M
• Description: IC PROC CELERON M 1.06GHZ 479BGA
• Manufacturer: Intel

Specifications of LE80538VE0041M

• Processor Type: Celeron M
• Features: 533MHZ Bus, 1M L2 Cache
• Speed: 1.06GHz
• Voltage: 0.94V
• Mounting Type: Surface Mount
• Package / Case: 479-BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 883549

Contents
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2
3
4
5
6
Intel
®
Celeron
®
1.1
1.2
1.3
2.1
2.2
2.3
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
3.10
4.1
4.2
5.1
6.1
Introduction ...................................................................................................................... 7
Low Power Features ...................................................................................................... 11
Electrical Specifications ................................................................................................ 15
Package Mechanical Specifications and Pin Information .......................................... 29
Thermal Specifications and Design Considerations .................................................. 63
Debug Tools Specifications .......................................................................................... 69
M Processor Datasheet
Terminology ........................................................................................................... 8
References.............................................................................................................9
State of Data .......................................................................................................... 9
Clock Control and Low Power States................................................................... 11
2.1.1
2.1.2
2.1.3
2.1.4
2.1.5
2.1.6
FSB Low Power Enhancements .......................................................................... 13
Processor Power Status Indicator (PSI#) Signal.................................................. 14
FSB and GTLREF ................................................................................................ 15
Power and Ground Pins ....................................................................................... 15
Decoupling Guidelines ......................................................................................... 15
3.3.1
3.3.2
3.3.3
Voltage Identification............................................................................................ 16
Catastrophic Thermal Protection.......................................................................... 17
Signal Terminations and Unused Pins .................................................................18
FSB Signal Groups ..............................................................................................18
CMOS Signals ..................................................................................................... 19
Maximum Ratings ................................................................................................ 20
Processor DC Specifications................................................................................ 20
Processor Pin-Out and Pin List ............................................................................ 37
Alphabetical Signals Reference ........................................................................... 56
Thermal Specifications......................................................................................... 65
5.1.1
5.1.2
6.1.1
6.1.2
Logic Analyzer Interface (LAI)............................................................................. 69
Normal State ........................................................................................... 11
AutoHALT Power-Down State.................................................................11
Stop-Grant State ..................................................................................... 12
HALT/Grant Snoop State ........................................................................ 12
Sleep State..............................................................................................12
Deep Sleep State .................................................................................... 13
VCC Decoupling ...................................................................................... 16
FSB AGTL+ Decoupling .......................................................................... 16
FSB Clock (BCLK[1:0]) and Processor Clocking..................................... 16
Thermal Diode......................................................................................... 65
Intel Thermal Monitor .............................................................................. 66
Mechanical Considerations ..................................................................... 69
Electrical Considerations......................................................................... 69
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