MPC860ENVR50D4 Freescale Semiconductor, MPC860ENVR50D4 Datasheet - Page 75

IC MPU POWERQUICC 50MHZ 357PBGA

MPC860ENVR50D4

Manufacturer Part Number
MPC860ENVR50D4
Description
IC MPU POWERQUICC 50MHZ 357PBGA
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MPC860ENVR50D4

Processor Type
MPC8xx PowerQUICC 32-Bit
Speed
50MHz
Voltage
3.3V
Mounting Type
Surface Mount
Package / Case
357-PBGA
Family Name
MPC8xx
Device Core
PowerQUICC
Device Core Size
32b
Frequency (max)
50MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.465/3.6V
Operating Supply Voltage (min)
2/3.135V
Operating Temp Range
0C to 95C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
357
Package Type
BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Compliant

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Part Number
Manufacturer
Quantity
Price
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MPC860ENVR50D4
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Manufacturer:
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Part Number:
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Quantity:
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Figure 78
Freescale Semiconductor
Figure 78. Mechanical Dimensions and Bottom Surface Nomenclature of the ZQ PBGA Package
shows the mechanical dimensions of the ZQ PBGA package.
1.
2.
3.
4.
All Dimensions in millimeters.
Dimensions and tolerance per ASME Y14.5M, 1994.
Maximum Solder Ball Diameter measured parallel to Datum A.
Datum A, the seating plane, is defined by the spherical crowns of the solder balls.
MPC860 PowerQUICC™ Family Hardware Specifications, Rev. 8
NOTE
Mechanical Data and Ordering Information
75

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