MPC8349EVVAJDB Freescale Semiconductor, MPC8349EVVAJDB Datasheet - Page 54

• Manufacturer Part Number: MPC8349EVVAJDB
• Description: IC MPU PWRQUICC II 672-TBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC8349EVVAJDB

• Processor Type: MPC83xx PowerQUICC II Pro 32-Bit
• Speed: 533MHz
• Voltage: 1.2V
• Mounting Type: Surface Mount
• Package / Case: 672-TBGA
• Family Name: MPC83xx
• Device Core: PowerQUICC II Pro
• Device Core Size: 32b
• Frequency (max): 533MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.2V
• Operating Supply Voltage (max): 1.26V
• Operating Supply Voltage (min): 1.14V
• Operating Temp Range: 0C to 105C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 672
• Package Type: TBGA
• For Use With: MPC8349E-MITX-GP - KIT REFERENCE PLATFORM MPC8349EMPC8349E-MITXE - BOARD REFERENCE FOR MPC8349MPC8349EA-MDS-PB - KIT MODULAR DEV SYSTEM MPC8349E
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Compliant

Package and Pin Listings
18.1
The package parameters are provided in the following list. The package type is 35 mm × 35 mm, 672 tape
ball grid array (TBGA).
54
Package outline
Interconnects
Pitch
Module height (typical)
Solder balls
Ball diameter (typical)
Package Parameters for the MPC8349EA TBGA
MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
672
1.00 mm
1.46 mm
62 Sn/36 Pb/2 Ag (ZU package)
96.5 Sn/3.5Ag (VV package)
0.64 mm
35 mm × 35 mm
Freescale Semiconductor