MPC860TZQ66D4 Freescale Semiconductor, MPC860TZQ66D4 Datasheet - Page 8

• Manufacturer Part Number: MPC860TZQ66D4
• Description: IC MPU POWERQUICC 66MHZ 357PBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC860TZQ66D4

• Processor Type: MPC8xx PowerQUICC 32-Bit
• Speed: 66MHz
• Voltage: 3.3V
• Mounting Type: Surface Mount
• Package / Case: 357-PBGA
• Family Name: MPC8xx
• Device Core: PowerQUICC
• Device Core Size: 32b
• Frequency (max): 66MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.465/3.6V
• Operating Supply Voltage (min): 2/3.135V
• Operating Temp Range: 0C to 95C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 357
• Package Type: BGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Lead Free Status / Rohs Status: Not Compliant

Thermal Characteristics
Figure 1
4
8
Thermal Characteristics
shows the undershoot and overshoot voltages at the interface of the MPC860.
Package Designator
V
Note:
V
1. t
IH
IL
interface
ZQ/VR
V
Figure 1. Undershoot/Overshoot Voltage for V
V
DDH
ZP
MPC860 PowerQUICC™ Family Hardware Specifications, Rev. 8
DDH
/V
GND – 0.3 V
GND – 0.7 V
refers to the clock period associated with the bus clock interface.
/V
V
DDL
DDH
DDL
+ 20%
/V
+ 5%
GND
DDL
Table 3. Package Description
Package Code (Case No.)
5058 (1103D-02)
5050 (1103-01)
Not to Exceed 10%
of t
interface
1
PBGA 357 25*25*0.9P1.27
PBGA 357 25*25*1.2P1.27
Package Description
DDH
and V
DDL
Freescale Semiconductor