MPC8347CVRAGDB Freescale Semiconductor, MPC8347CVRAGDB Datasheet - Page 87

• Manufacturer Part Number: MPC8347CVRAGDB
• Description: IC MPU POWERQUICC II 620-PBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC II PROr

Specifications of MPC8347CVRAGDB

• Processor Type: MPC83xx PowerQUICC II Pro 32-Bit
• Speed: 400MHz
• Voltage: 1.2V
• Mounting Type: Surface Mount
• Package / Case: 620-PBGA
• Core Size: 32 Bit
• Program Memory Size: 64KB
• Cpu Speed: 400MHz
• Embedded Interface Type: I2C, SPI, USB, UART
• Digital Ic Case Style: BGA
• No. Of Pins: 672
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -

where:
R
change the case-to-ambient thermal resistance, R
sink, the air flow around the device, the interface material, the mounting arrangement on printed-circuit
board, or change the thermal dissipation on the printed-circuit board surrounding the device.
The thermal performance of devices with heat sinks has been simulated with a few commercially available
heat sinks. The heat sink choice is determined by the application environment (temperature, air flow,
adjacent component power dissipation) and the physical space available. Because there is not a standard
application environment, a standard heat sink is not required.
Table 63
Freescale Semiconductor
θ
f
JC
AAVID 30 × 30 × 9.4 mm pin fin
AAVID 30 × 30 × 9.4 mm pin fin
AAVID 30 × 30 × 9.4 mm pin fin
AAVID 31 × 35 × 23 mm pin fin
AAVID 31 × 35 × 23 mm pin fin
AAVID 31 × 35 × 23 mm pin fin
Wakefield, 53 × 53 × 25 mm pin fin
Wakefield, 53 × 53 × 25 mm pin fin
Wakefield, 53 × 53 × 25 mm pin fin
MEI, 75 × 85 × 12 no adjacent board, extrusion
MEI, 75 × 85 × 12 no adjacent board, extrusion
MEI, 75 × 85 × 12 no adjacent board, extrusion
MEI, 75 × 85 × 12 mm, adjacent board, 40 mm side bypass
AAVID 30 × 30 × 9.4 mm pin fin
AAVID 30 × 30 × 9.4 mm pin fin
is device-related and cannot be influenced by the user. The user controls the thermal environment to
R
R
R
θ
θ
θ
and
JA
JC
CA
MPC8347E PowerQUICC™ II Pro Integrated Host Processor Hardware Specifications, Rev. 11
= junction-to-ambient thermal resistance (°C/W)
= junction-to-case thermal resistance (°C/W)
= case-to-ambient thermal resistance (°C/W)
Table 64
Heat Sink Assuming Thermal Grease
Heat Sink Assuming Thermal Grease
Table 64. Heat Sink and Thermal Resistance of MPC8347E (PBGA)
Table 63. Heat Sink and Thermal Resistance of MPC8347E (TBGA)
show heat sink thermal resistance for TBGA and PBGA of the MPC8347E.
θ
CA
. For instance, the user can change the size of the heat
Natural convection
Natural convection
Natural convection
Natural convection
Natural convection
Air Flow
Air Flow
1 m/s
2 m/s
1 m/s
2 m/s
1 m/s
2 m/s
1 m/s
2 m/s
1 m/s
1 m/s
Thermal Resistance
Thermal Resistance
35 × 35 mm TBGA
29 × 29 mm PBGA
13.5
6.5
5.6
8.4
4.7
5.7
3.5
2.7
6.7
4.1
2.8
3.1
9.6
10
4
Thermal
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