MPC8260AZUMHBB Freescale Semiconductor, MPC8260AZUMHBB Datasheet - Page 37

• Manufacturer Part Number: MPC8260AZUMHBB
• Description: IC MPU POWERQUICC II 480-TBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC8260AZUMHBB

• Processor Type: MPC82xx PowerQUICC II 32-bit
• Speed: 266MHz
• Voltage: 2V
• Mounting Type: Surface Mount
• Package / Case: 480-TBGA
• Processor Series: MPC8xxx
• Core: 603e
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 266 MHz
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: 0 C
• Leaded Process Compatible: Yes
• Peak Reflow Compatible (260 C): No
• Rohs Compliant: No
• For Use With: MPC8260ADS-TCOM - BOARD DEV ADS POWERQUICC II
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

5
The following sections provide the package parameters and mechanical dimensions for the MPC8260.
5.1
Package parameters are provided in
Freescale Semiconductor
UTS
UT8
UT16
MII
Package Description
MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2
Package Parameters
Symbol
Package Outline
Interconnects
Pitch
Nominal unmounted package height 1.55 mm
Table 15. Symbol Legend (continued)
Parameter
Table
Table 16. Package Parameters
16. The package type is a 37.5 × 37.5 mm, 480-lead TBGA.
Indicates that a signal is part of the UTOPIA slave interface
Indicates that a signal is part of the 8-bit UTOPIA interface
Indicates that a signal is part of the 16-bit UTOPIA interface
Indicates that a signal is part of the media independent interface
37.5 x 37.5 mm
480 (29 x 29 ball array)
1.27 mm
Value
Meaning
Package Description
37