MPC8360VVAGDGA Freescale Semiconductor, MPC8360VVAGDGA Datasheet - Page 9

• Manufacturer Part Number: MPC8360VVAGDGA
• Description: IC MPU POWERQUICC II PRO 740TBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC8360VVAGDGA

• Processor Type: MPC83xx PowerQUICC II Pro 32-Bit
• Speed: 400MHz
• Voltage: 1.2V
• Mounting Type: Surface Mount
• Package / Case: 740-TBGA
• Processor Series: MPC8xxx
• Core: e300
• Data Bus Width: 32 bit
• Development Tools By Supplier: MPC8360E-RDK
• Maximum Clock Frequency: 400 MHz
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• I/o Voltage: 1.8 V, 2.5 V, 3.3 V
• Minimum Operating Temperature: 0 C
• For Use With: MPC8360EA-MDS-PB - KIT APPLICATION DEV 8360 SYSTEMMPC8360E-RDK - BOARD REFERENCE DESIGN FOR MPC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

2.1
This section covers the ratings, conditions, and other characteristics.
2.1.1
Table 1
Freescale Semiconductor
Core supply voltage
frequencies <667 MHz
frequency of 667 MHz
PLL supply voltage
frequencies <667 MHz
frequency of 667 MHz
DDR and DDR2 DRAM I/O voltage
Three-speed Ethernet I/O, MII management voltage
PCI, local bus, DUART, system control and power management, I
SPI, and JTAG I/O voltage
Input voltage
Storage temperature range
Notes:
1. Functional and tested operating conditions are given in
2. Caution: MV
3. Caution: OV
4. Caution: LV
5. (M,L,O)V
6. OV
For QUICC Engine module frequencies <500 MHz and e300
For a QUICC Engine module frequency of 500 MHz or an e300
For QUICC Engine module frequencies <500 MHz and e300
For a QUICC Engine module frequency of 500 MHz or an e300
functional operation at the maximums is not guaranteed. Stresses beyond those listed may affect device reliability or cause
permanent damage to the device.
power-on reset and power-down sequences.
power-on reset and power-down sequences.
power-on reset and power-down sequences.
shown in
MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 4
IN
on the PCI interface may overshoot/undershoot according to the PCI Electrical Specification for 3.3-V operation, as
provides the absolute maximum ratings.
Overall DC Electrical Characteristics
IN
Figure
Absolute Maximum Ratings
and MV
IN
IN
IN
must not exceed LV
must not exceed OV
must not exceed GV
4.
REF
DDR DRAM signals
DDR DRAM reference
Three-speed Ethernet signals
Local bus, DUART, CLKIN, system control
and power management, I
JTAG signals
PCI
Characteristic
may overshoot/undershoot to a voltage and for a maximum duration as shown in
DD
DD
DD
by more than 0.3 V. This limit may be exceeded for a maximum of 100 ms during
Table 1. Absolute Maximum Ratings
by more than 0.3 V. This limit may be exceeded for a maximum of 100 ms during
by more than 0.3 V. This limit may be exceeded for a maximum of 100 ms during
2
C, SPI, and
Table
DDR2
DDR
2
2. Absolute maximum ratings are stress ratings only, and
C,
Symbol
MV
GV
OV
AV
MV
LV
OV
OV
T
LV
V
STG
DD
DD
REF
DD
DD
DD
IN
IN
IN
IN
–0.3 to (GV
–0.3 to (GV
–0.3 to (OV
–0.3 to (OV
–0.3 to (LV
1
–0.3 to 1.32
–0.3 to 1.37
–0.3 to 1.32
–0.3 to 1.37
–0.3 to 2.75
–0.3 to 1.89
–0.3 to 3.63
–0.3 to 3.63
Max Value
–55 to 150
DD
DD
DD
DD
DD
+ 0.3)
+ 0.3)
+ 0.3)
+ 0.3)
+ 0.3)
Electrical Characteristics
Figure
Unit
°C
V
V
V
V
V
V
V
V
V
V
3.
Notes
2, 5
2, 5
4, 5
3, 5
—
—
—
—
—
—
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