MPC855TZQ50D4 Freescale Semiconductor, MPC855TZQ50D4 Datasheet - Page 75

• Manufacturer Part Number: MPC855TZQ50D4
• Description: IC MPU POWERQUICC 50MHZ 357PBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC Ir

Specifications of MPC855TZQ50D4

• Processor Type: MPC8xx PowerQUICC 32-Bit
• Speed: 50MHz
• Voltage: 3.3V
• Mounting Type: Surface Mount
• Package / Case: 357-PBGA
• Processor Series: MPC8xx
• Core: MPC8xx
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 50 MHz
• Operating Supply Voltage: 2.5 V, 3.3 V
• Maximum Operating Temperature: + 95 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: 0 C
• Core Size: 32 Bit
• Program Memory Size: 8KB
• Cpu Speed: 50MHz
• Embedded Interface Type: Ethernet, I2C, SPI, UART
• Digital Ic Case Style: BGA
• No. Of Pins: 357
• Rohs Compliant: No
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Figure 78
Freescale Semiconductor
Figure 78. Mechanical Dimensions and Bottom Surface Nomenclature of the ZQ PBGA Package
shows the mechanical dimensions of the ZQ PBGA package.
1.
2.
3.
4.
All Dimensions in millimeters.
Dimensions and tolerance per ASME Y14.5M, 1994.
Maximum Solder Ball Diameter measured parallel to Datum A.
Datum A, the seating plane, is defined by the spherical crowns of the solder balls.
MPC860 PowerQUICC™ Family Hardware Specifications, Rev. 8
NOTE
Mechanical Data and Ordering Information
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